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    Method of manufacturing substrate using a carrier
    1.
    发明授权
    Method of manufacturing substrate using a carrier 失效
    使用载体制造衬底的方法

    公开(公告)号：US08677618B2

    公开(公告)日：2014-03-25

    申请号：US13137631

    申请日：2011-08-30

    Applicant: Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    Inventor： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    IPC: H05K3/02 ,  H05K3/10

    CPC classification number: H05K3/0097 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/1536

    Abstract: A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

    Abstract translation: 使用载体制造衬底的方法，其包括制备具有释放层的载体，以及顺序地设置在释放层两侧的绝缘层和金属层; 图案化金属层以形成基极电路层; 在基极电路层上形成积层; 执行布线过程以将绝缘层与释放层分离; 以及在堆积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。

    Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier
    2.
    发明申请
    Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier 审中-公开
    用于制造基板的载体和使用载体制造基板的方法

    公开(公告)号：US20100147559A1

    公开(公告)日：2010-06-17

    申请号：US12382359

    申请日：2009-03-13

    Applicant: Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    Inventor： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    IPC: H05K1/02 ,  H05K3/02

    CPC classification number: H05K3/0097 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/1536

    Abstract: The invention relates to a carrier used in the manufacture of a substrate and a method of manufacturing a substrate using the carrier, the method including (A) preparing a carrier comprising a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; (B) patterning the metal layers to form base circuit layers; (C) forming buildup layers on the base circuit layers; (D) executing a routing process to separate the insulating layers from the releasing layer; and (E) forming solder-resist layers on the buildup layers and forming openings in-the solder-resist layers and the insulating layers to expose pads.

    Abstract translation: 本发明涉及用于制造基板的载体和使用该载体制造基板的方法，该方法包括：（A）制备包括释放层的载体，以及顺序地设置在两侧的绝缘层和金属层 释放层; （B）图案化金属层以形成基极电路层; （C）在基极电路层上形成积层; （D）执行路由处理以将绝缘层与释放层分离; 和（E）在积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。

    Method of manufacturing substrate using a carrier
    3.
    发明申请
    Method of manufacturing substrate using a carrier 失效
    使用载体制造衬底的方法

    公开(公告)号：US20110318480A1

    公开(公告)日：2011-12-29

    申请号：US13137631

    申请日：2011-08-30

    Applicant: Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    Inventor： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    IPC: H05K3/00

    CPC classification number: H05K3/0097 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/1536

    Abstract: A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

    Abstract translation: 使用载体制造衬底的方法，其包括制备具有释放层的载体，以及顺序地设置在释放层两侧的绝缘层和金属层; 图案化金属层以形成基极电路层; 在基极电路层上形成积层; 执行布线过程以将绝缘层与释放层分离; 以及在堆积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。

    Method of manufacturing printed circuit board
    7.
    发明授权
    Method of manufacturing printed circuit board 有权
    制造印刷电路板的方法

    公开(公告)号：US08881381B2

    公开(公告)日：2014-11-11

    申请号：US12631594

    申请日：2009-12-04

    Applicant: Mi Sun Hwang ,  Myung Sam Kang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

    Inventor： Mi Sun Hwang ,  Myung Sam Kang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

    IPC: H05K3/36 ,  H05K3/10 ,  H05K3/20 ,  H05K3/46 ,  H05K3/00 ,  H05K3/42

    CPC classification number: H05K3/4685 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/421 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

    Abstract translation: 本文公开了一种制造印刷电路板的方法，包括：制备第一载体，其包括在其一侧上形成的第一图案; 制备包括在其一侧上顺序形成的第一阻焊层和第二图案的第二载体; 按压第一载体和第二载体，使得第一图案嵌入绝缘层的一侧，并且将第二图案嵌入绝缘层的另一侧，然后移除第一载体和第二载体以制造两个基板 ; 使用粘合层将两个基板彼此连接，使得第一阻焊层彼此面对; 以及形成用于在绝缘层中连接第一图案与第二图案的通孔，在设置有第一图案的绝缘层上形成第二阻焊剂，然后除去粘合层。

    Printed circuit board
    8.
    发明授权
    Printed circuit board 有权
    印刷电路板

    公开(公告)号：US08080741B2

    公开(公告)日：2011-12-20

    申请号：US12149522

    申请日：2008-05-02

    Applicant: Myung Sam Kang ,  Chin Kwan Kim

    Inventor： Myung Sam Kang ,  Chin Kwan Kim

    IPC: H05K1/11

    CPC classification number: H05K3/4007 ,  H05K3/246 ,  H05K3/3457 ,  H05K3/4069 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/09481 ,  H05K2201/09745

    Abstract: A printed circuit board, which increases the contact area between an IC and a printed circuit board, thus increasing the degree of adhesion, is disclosed. The printed circuit board includes: an insulation layer which includes a first circuit pattern, including at least one via land, embedded in the upper surface of the insulation layer to be flush with the upper surface, and a second circuit pattern formed in the lower surface of the insulation layer to be flush with the lower surface; a solder resist layer formed on the insulation layer; a via hole and a bump integrally formed on the second circuit pattern through the via hole and the via land such that it protrudes from the insulation layer to be higher than the solder resist layer.

    Abstract translation: 公开了一种印刷电路板，其增加了IC和印刷电路板之间的接触面积，从而增加了粘合度。 印刷电路板包括：绝缘层，其包括嵌入在绝缘层的上表面中以与上表面齐平的至少一个通孔焊盘的第一电路图案，以及形成在下表面中的第二电路图案 的绝缘层与下表面齐平; 形成在绝缘层上的阻焊层; 通孔和通过通孔和通孔焊盘一体地形成在第二电路图案上的突起，使得其从绝缘层突出成高于阻焊层。

    Method of fabricating printed circuit board
    9.
    发明申请
    Method of fabricating printed circuit board 审中-公开
    制造印刷电路板的方法

    公开(公告)号：US20110067233A1

    公开(公告)日：2011-03-24

    申请号：US12654669

    申请日：2009-12-29

    Applicant: Seon Ha Kang ,  Myung Sam Kang ,  Mi Sun Hwang ,  Kil Yong Yun ,  Min Jung Cho ,  Gil Yong Shin ,  Ok Tae Kim

    Inventor： Seon Ha Kang ,  Myung Sam Kang ,  Mi Sun Hwang ,  Kil Yong Yun ,  Min Jung Cho ,  Gil Yong Shin ,  Ok Tae Kim

    IPC: H05K3/10

    CPC classification number: H05K3/465 ,  H05K3/0041 ,  H05K3/045 ,  H05K3/064 ,  H05K3/107 ,  H05K3/108 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/09036 ,  Y10T29/49155

    Abstract: A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity.

    Abstract translation: 一种制造印刷电路板的方法，所述方法包括：提供具有形成有第一电路图案的第一表面的绝缘基体和与所述第一表面相对的第二表面; 将绝缘基体的第一表面压在绝缘层的至少一个表面上，使得第一电路图案嵌入绝缘层中; 在绝缘基体的第二表面上形成具有所需图案的抗蚀剂; 通过在其上形成有抗蚀剂的绝缘基体的第二表面上进行等离子体处理来形成沟槽; 以及通过用导电材料填充所述沟槽来形成第二电路图案。 因此，可以使用简单的工艺形成导电图案，从而提高处理速度和生产率。

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