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14 条记录 (耗时 0.019 秒)

    Method of manufacturing substrate using a carrier
    1.
    发明申请
    Method of manufacturing substrate using a carrier 失效
    使用载体制造衬底的方法

    公开(公告)号：US20110318480A1

    公开(公告)日：2011-12-29

    申请号：US13137631

    申请日：2011-08-30

    申请人： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    发明人： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    IPC分类号： H05K3/00

    CPC分类号： H05K3/0097 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/1536

    摘要： A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

    摘要翻译： 使用载体制造衬底的方法，其包括制备具有释放层的载体，以及顺序地设置在释放层两侧的绝缘层和金属层; 图案化金属层以形成基极电路层; 在基极电路层上形成积层; 执行布线过程以将绝缘层与释放层分离; 以及在堆积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。

    Method of manufacturing substrate using a carrier
    2.
    发明授权
    Method of manufacturing substrate using a carrier 失效
    使用载体制造衬底的方法

    公开(公告)号：US08677618B2

    公开(公告)日：2014-03-25

    申请号：US13137631

    申请日：2011-08-30

    申请人： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    发明人： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    IPC分类号： H05K3/02 ,  H05K3/10

    CPC分类号： H05K3/0097 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/1536

    摘要： A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

    摘要翻译： 使用载体制造衬底的方法，其包括制备具有释放层的载体，以及顺序地设置在释放层两侧的绝缘层和金属层; 图案化金属层以形成基极电路层; 在基极电路层上形成积层; 执行布线过程以将绝缘层与释放层分离; 以及在堆积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。

    Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier
    3.
    发明申请
    Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier 审中-公开
    用于制造基板的载体和使用载体制造基板的方法

    公开(公告)号：US20100147559A1

    公开(公告)日：2010-06-17

    申请号：US12382359

    申请日：2009-03-13

    申请人： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    发明人： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    IPC分类号： H05K1/02 ,  H05K3/02

    CPC分类号： H05K3/0097 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/1536

    摘要： The invention relates to a carrier used in the manufacture of a substrate and a method of manufacturing a substrate using the carrier, the method including (A) preparing a carrier comprising a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; (B) patterning the metal layers to form base circuit layers; (C) forming buildup layers on the base circuit layers; (D) executing a routing process to separate the insulating layers from the releasing layer; and (E) forming solder-resist layers on the buildup layers and forming openings in-the solder-resist layers and the insulating layers to expose pads.

    摘要翻译： 本发明涉及用于制造基板的载体和使用该载体制造基板的方法，该方法包括：（A）制备包括释放层的载体，以及顺序地设置在两侧的绝缘层和金属层 释放层; （B）图案化金属层以形成基极电路层; （C）在基极电路层上形成积层; （D）执行路由处理以将绝缘层与释放层分离; 和（E）在积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。