发明申请
- 专利标题： HEAT TRANSFER FOR A HARD-DRIVE PRE-AMP
- 专利标题（中）： 硬传动预热器的换热
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申请号： US13214120申请日： 2011-08-19
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公开(公告)号： US20120008227A1公开(公告)日： 2012-01-12
- 发明人: Martin John McCaslin , Szu-Han Hu , Alex Enriquez Cayaban , Voon Yee Ho
- 申请人： Martin John McCaslin , Szu-Han Hu , Alex Enriquez Cayaban , Voon Yee Ho
- 申请人地址： JP Osaka
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 当前专利权人地址： JP Osaka
- 主分类号： B32B3/10
- IPC分类号： B32B3/10 ; H05K3/00 ; G11B5/09
摘要：
A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
公开/授权文献
- US08213125B2 Heat transfer for a hard-drive pre-amp 公开/授权日：2012-07-03
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