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公开(公告)号：US20080088977A1
公开(公告)日：2008-04-17
申请号：US11548681
申请日：2006-10-11
IPC分类号： G11B5/55
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
摘要翻译： 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。
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公开(公告)号：US20120238072A1
公开(公告)日：2012-09-20
申请号：US13487435
申请日：2012-06-04
IPC分类号： H01L21/78
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
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3.发明申请公开(公告)号：US20100046351A1
公开(公告)日：2010-02-25
申请号：US12495323
申请日：2009-06-30
IPC分类号： G11B17/00
CPC分类号： G11B5/4833 , G11B5/4826 , G11B5/4853
摘要： Disclosed are various techniques for reduction of the magnitude of the residual stress in the HDD gimbal circuits, or more specifically, the residual plastic strain. Various trace structures of the gimbal circuits as well as stress suppressors are utilized to achieve the reduction of the residual stress in the circuit.
摘要翻译： 公开了用于减小HDD万向电路中的残余应力的大小的各种技术，或者更具体地说，是残余塑性应变。 使用万向电路的各种迹线结构以及应力抑制器来实现电路中残余应力的降低。
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4.发明授权公开(公告)号：US08434223B2
公开(公告)日：2013-05-07
申请号：US13487435
申请日：2012-06-04
IPC分类号： H01R43/00
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
摘要翻译： 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。
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公开(公告)号：US08213125B2
公开(公告)日：2012-07-03
申请号：US13214120
申请日：2011-08-19
IPC分类号： G11B5/55
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
摘要翻译： 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。
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6.发明申请公开(公告)号：US20120229934A1
公开(公告)日：2012-09-13
申请号：US13481530
申请日：2012-05-25
IPC分类号： G11B5/48
CPC分类号： G11B5/4833 , G11B5/4826 , G11B5/4853
摘要： Disclosed are various techniques for reduction of the magnitude of the residual stress in the HDD gimbal circuits, or more specifically, the residual plastic strain. Various trace structures of the gimbal circuits as well as stress suppressors are utilized to achieve the reduction of the residual stress in the circuit.
摘要翻译： 公开了用于减小HDD万向电路中的残余应力的大小的各种技术，或者更具体地说，是残余塑性应变。 使用万向电路的各种迹线结构以及应力抑制器来实现电路中残余应力的降低。
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7.发明授权公开(公告)号：US08173909B2
公开(公告)日：2012-05-08
申请号：US11875422
申请日：2007-10-19
CPC分类号： H05K3/363 , G11B5/4846 , H05K1/0269 , H05K1/056 , H05K2201/09063 , H05K2201/0969 , Y10T29/49124 , Y10T29/53209
摘要： Inspection windows are cut or formed into the tail section of the flexure circuit tail in a hard disk drive Head Gimbal Assembly (HGA), or CIS, to enable visual inspection of the alignment of the CIS to the head preamp circuit, or FPC. The holes are made in the steel backing and base polyimide, and are positioned between adjacent conductive pads. In addition to facilitating visual inspection, the windows also enable rework of solder. Additionally, solder wicking holes may also be provided in the conductive pads and/or the polyimide and steel backing.
摘要翻译： 在硬盘驱动头万向节组件（HGA）或CIS中，将检查窗口切割或形成弯曲回路尾部的尾部，以便可以目视检查CIS与头前置放大器电路或FPC的对齐。 孔由钢背衬和基底聚酰亚胺制成，并且位于相邻的导电垫之间。 除了便于目视检查外，窗户还可以进行焊接返修。 此外，也可以在导电焊盘和/或聚酰亚胺和钢背衬中提供焊料芯吸孔。
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8.发明授权Copper residual stress relaxation reduction means for hard disk drive slider gimbals 有权铜残余应力松弛减少装置用于硬盘驱动器滑块万向节公开(公告)号：US08570687B2
公开(公告)日：2013-10-29
申请号：US13481530
申请日：2012-05-25
CPC分类号： G11B5/4833 , G11B5/4826 , G11B5/4853
摘要： Disclosed are various techniques for reduction of the magnitude of the residual stress in the HDD gimbal circuits, or more specifically, the residual plastic strain. Various trace structures of the gimbal circuits as well as stress suppressors are utilized to achieve the reduction of the residual stress in the circuit.
摘要翻译： 公开了用于减小HDD万向电路中的残余应力的大小的各种技术，或者更具体地说，是残余塑性应变。 使用万向电路的各种迹线结构以及应力抑制器来实现电路中残余应力的降低。
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公开(公告)号：US20120008227A1
公开(公告)日：2012-01-12
申请号：US13214120
申请日：2011-08-19
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
摘要翻译： 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。
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10.发明申请公开(公告)号：US20080099236A1
公开(公告)日：2008-05-01
申请号：US11875422
申请日：2007-10-19
CPC分类号： H05K3/363 , G11B5/4846 , H05K1/0269 , H05K1/056 , H05K2201/09063 , H05K2201/0969 , Y10T29/49124 , Y10T29/53209
摘要： Inspection windows are cut or formed into the tail section of the flexure circuit tail in a hard disk drive Head Gimbal Assembly (HGA), or CIS, to enable visual inspection of the alignment of the CIS to the head preamp circuit, or FPC. The holes are made in the steel backing and base polyimide, and are positioned between adjacent conductive pads. In addition to facilitating visual inspection, the windows also enable rework of solder. Additionally, solder wicking holes may also be provided in the conductive pads and/or the polyimide and steel backing.
摘要翻译： 在硬盘驱动头万向节组件（HGA）或CIS中，将检查窗口切割或形成弯曲回路尾部的尾部，以便可以目视检查CIS与头前置放大器电路或FPC的对齐。 孔由钢背衬和基底聚酰亚胺制成，并且位于相邻的导电垫之间。 除了便于目视检查外，窗户还可以进行焊接返修。 此外，也可以在导电焊盘和/或聚酰亚胺和钢背衬中提供焊料芯吸孔。
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