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公开(公告)号：US20080088977A1
公开(公告)日：2008-04-17
申请号：US11548681
申请日：2006-10-11
IPC分类号： G11B5/55
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
摘要翻译： 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。
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2.发明授权公开(公告)号：US08434223B2
公开(公告)日：2013-05-07
申请号：US13487435
申请日：2012-06-04
IPC分类号： H01R43/00
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
摘要翻译： 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。
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公开(公告)号：US08213125B2
公开(公告)日：2012-07-03
申请号：US13214120
申请日：2011-08-19
IPC分类号： G11B5/55
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
摘要翻译： 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。
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公开(公告)号：US20120008227A1
公开(公告)日：2012-01-12
申请号：US13214120
申请日：2011-08-19
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
摘要翻译： 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。
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公开(公告)号：US20090301775A1
公开(公告)日：2009-12-10
申请号：US12461576
申请日：2009-08-17
IPC分类号： H05K5/00
CPC分类号： H05K1/0271 , H05K1/0219 , H05K1/028 , H05K1/148 , H05K2201/09063 , H05K2201/09236 , H05K2201/09563 , H05K2201/09809
摘要： A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer.
摘要翻译： 布线电路板具有沿纵向方向延伸的绝缘层，导电层具有覆盖有绝缘层的多个信号布线，并且沿垂直于纵向的方向以相互间隔开的平行关系布置，厚度方向 的绝缘层，以及设置在每个信号布线的两个纵向端并从绝缘层露出的连接端子，以及覆盖有绝缘层的接地层，并且形成为围绕每个信号布线沿垂直于 纵向。 在绝缘层中的每个信号布线之间形成沿着纵向的狭缝。
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公开(公告)号：US08022308B2
公开(公告)日：2011-09-20
申请号：US11902553
申请日：2007-09-24
IPC分类号： H05K1/00
CPC分类号： H05K1/0271 , H05K1/0219 , H05K1/028 , H05K1/148 , H05K2201/09063 , H05K2201/09236 , H05K2201/09563 , H05K2201/09809
摘要： A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer.
摘要翻译： 布线电路板具有沿纵向方向延伸的绝缘层，导电层具有覆盖有绝缘层的多个信号布线，并且沿垂直于纵向的方向以相互间隔开的平行关系布置，厚度方向 的绝缘层，以及设置在每个信号布线的两个纵向端并从绝缘层露出的连接端子，以及覆盖有绝缘层的接地层，并且形成为围绕每个信号布线沿垂直于 纵向。 在绝缘层中的每个信号布线之间形成沿着纵向的狭缝。
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公开(公告)号：US07569773B2
公开(公告)日：2009-08-04
申请号：US11902556
申请日：2007-09-24
IPC分类号： H01B7/08
CPC分类号： H05K1/0221 , H05K1/117 , H05K3/4644 , H05K2201/09236 , H05K2201/09481 , H05K2201/09809 , H05K2203/0733
摘要： A wired circuit board has a plurality of insulating layers, a conductive layer having a signal wiring extending in a longitudinal direction which is covered with the insulating layers, and a signal connecting terminal provided on a longitudinal end of the signal wiring and exposed from the insulating layers, and a ground layer having a ground wiring covered with the insulating layers and formed to surround the signal wiring in a perpendicular direction to the longitudinal direction, and a ground connecting terminal provided on a longitudinal end of the ground wiring and exposed from the insulating layers. The signal connecting terminal and the ground connecting terminal are formed on an upper surface of the same insulating layer among the plurality of the insulating layers.
摘要翻译： 布线电路板具有多个绝缘层，导电层具有沿纵向方向延伸并被绝缘层覆盖的信号布线，以及信号连接端子，设置在信号布线的纵向端并从绝缘层 以及接地层，其具有覆盖有绝缘层的接地布线，并且形成为围绕与纵向方向垂直的方向的信号布线;以及接地端子，其设置在接地布线的纵向端部并从绝缘体 层。 信号连接端子和接地连接端子形成在多个绝缘层中的相同绝缘层的上表面上。
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公开(公告)号：US20080078573A1
公开(公告)日：2008-04-03
申请号：US11902553
申请日：2007-09-24
IPC分类号： H01R12/04
CPC分类号： H05K1/0271 , H05K1/0219 , H05K1/028 , H05K1/148 , H05K2201/09063 , H05K2201/09236 , H05K2201/09563 , H05K2201/09809
摘要： A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer.
摘要翻译： 布线电路板具有沿纵向方向延伸的绝缘层，导电层具有覆盖有绝缘层的多个信号布线，并且沿垂直于纵向的方向以相互间隔开的平行关系布置，厚度方向 的绝缘层，以及设置在每个信号布线的两个纵向端并从绝缘层露出的连接端子，以及覆盖有绝缘层的接地层，并且形成为围绕每个信号布线沿垂直于 纵向。 在绝缘层中的每个信号布线之间形成沿着纵向的狭缝。
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9.发明授权Copper residual stress relaxation reduction means for hard disk drive slider gimbals 有权铜残余应力松弛减少装置用于硬盘驱动器滑块万向节公开(公告)号：US08570687B2
公开(公告)日：2013-10-29
申请号：US13481530
申请日：2012-05-25
CPC分类号： G11B5/4833 , G11B5/4826 , G11B5/4853
摘要： Disclosed are various techniques for reduction of the magnitude of the residual stress in the HDD gimbal circuits, or more specifically, the residual plastic strain. Various trace structures of the gimbal circuits as well as stress suppressors are utilized to achieve the reduction of the residual stress in the circuit.
摘要翻译： 公开了用于减小HDD万向电路中的残余应力的大小的各种技术，或者更具体地说，是残余塑性应变。 使用万向电路的各种迹线结构以及应力抑制器来实现电路中残余应力的降低。
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10.发明申请FLEXURE BASED SHOCK AND VIBRATION SENSOR FOR HEAD SUSPENSIONS IN HARD DISK DRIVES 有权用于硬盘驱动器中的头枕的基于挠性的震动和振动传感器公开(公告)号：US20090168249A1
公开(公告)日：2009-07-02
申请号：US12324710
申请日：2008-11-26
IPC分类号： G11B5/48
CPC分类号： G11B5/4833 , G11B5/4826 , G11B19/042
摘要： Systems and methods for flexure based shock and vibration sensor for head suspensions in hard disk drives. Specifically, this invention deals with operational shock and vibration management within a hard disk drive. In one implementation, the assembly includes a circuit embedded optical waveguide sensor that includes a flexible electrical circuit board with a configuration of either a single or multi layers of conductor traces, a thin flexure gimbal for carrying and flying a HDD slider, a consecutive sensing layer constructed by an optical core and by clad construction with a configuration of either a single core array or a plural core array, an optical loop formed by light input and an output core, optical grating disposed on the consecutive sensing layer forming an optical grating waveguide sensor, a light emitter for injecting light into the optical core, and a receiver receiving the output light from the optical core.
摘要翻译： 用于基于挠性的冲击和振动传感器的系统和方法，用于硬盘驱动器中的头悬挂。 具体地，本发明涉及硬盘驱动器内的操作冲击和振动管理。 在一个实施方案中，组件包括电路嵌入式光波导传感器，其包括具有单层或多层导体迹线的配置的柔性电路板，用于承载和飞行HDD滑块的薄弯曲万向架，连续感测层 由光芯构成，通过包层结构构成单芯阵列或多芯阵列，由光输入和输出核形成的光环，配置在连续感测层上的光栅，形成光栅波导传感器 ，用于将光注入光纤芯的光发射器和接收来自光芯的输出光的接收器。
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