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13 条记录 (耗时 0.024 秒)

    Wired circuit board and electronic device
    5.
    发明授权
    Wired circuit board and electronic device 失效
    有线电路板和电子设备

    公开(公告)号：US08022308B2

    公开(公告)日：2011-09-20

    申请号：US11902553

    申请日：2007-09-24

    申请人： Szu-Han Hu ,  Voon Yee Ho ,  Hiroshi Yamazaki ,  Martin John McCaslin

    发明人： Szu-Han Hu ,  Voon Yee Ho ,  Hiroshi Yamazaki ,  Martin John McCaslin

    IPC分类号： H05K1/00

    CPC分类号： H05K1/0271 ,  H05K1/0219 ,  H05K1/028 ,  H05K1/148 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09563 ,  H05K2201/09809

    摘要： A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer.

    摘要翻译： 布线电路板具有沿纵向方向延伸的绝缘层，导电层具有覆盖有绝缘层的多个信号布线，并且沿垂直于纵向的方向以相互间隔开的平行关系布置，厚度方向 的绝缘层，以及设置在每个信号布线的两个纵向端并从绝缘层露出的连接端子，以及覆盖有绝缘层的接地层，并且形成为围绕每个信号布线沿垂直于 纵向。 在绝缘层中的每个信号布线之间形成沿着纵向的狭缝。

    Wired circuit board and electronic device
    6.
    发明申请
    Wired circuit board and electronic device 审中-公开
    有线电路板和电子设备

    公开(公告)号：US20090301775A1

    公开(公告)日：2009-12-10

    申请号：US12461576

    申请日：2009-08-17

    申请人： Szu-Han Hu ,  Voon Yee Ho ,  Hiroshi Yamazaki ,  Martin John McCaslin

    发明人： Szu-Han Hu ,  Voon Yee Ho ,  Hiroshi Yamazaki ,  Martin John McCaslin

    IPC分类号： H05K5/00

    CPC分类号： H05K1/0271 ,  H05K1/0219 ,  H05K1/028 ,  H05K1/148 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09563 ,  H05K2201/09809

    摘要： A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer.

    摘要翻译： 布线电路板具有沿纵向方向延伸的绝缘层，导电层具有覆盖有绝缘层的多个信号布线，并且沿垂直于纵向的方向以相互间隔开的平行关系布置，厚度方向 的绝缘层，以及设置在每个信号布线的两个纵向端并从绝缘层露出的连接端子，以及覆盖有绝缘层的接地层，并且形成为围绕每个信号布线沿垂直于 纵向。 在绝缘层中的每个信号布线之间形成沿着纵向的狭缝。

    Wired circuit board
    7.
    发明授权
    Wired circuit board 失效
    有线电路板

    公开(公告)号：US07569773B2

    公开(公告)日：2009-08-04

    申请号：US11902556

    申请日：2007-09-24

    申请人： Szu-Han Hu ,  Voon Yee Ho ,  Hiroshi Yamazaki ,  Martin John McCaslin

    发明人： Szu-Han Hu ,  Voon Yee Ho ,  Hiroshi Yamazaki ,  Martin John McCaslin

    IPC分类号： H01B7/08

    CPC分类号： H05K1/0221 ,  H05K1/117 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09481 ,  H05K2201/09809 ,  H05K2203/0733

    摘要： A wired circuit board has a plurality of insulating layers, a conductive layer having a signal wiring extending in a longitudinal direction which is covered with the insulating layers, and a signal connecting terminal provided on a longitudinal end of the signal wiring and exposed from the insulating layers, and a ground layer having a ground wiring covered with the insulating layers and formed to surround the signal wiring in a perpendicular direction to the longitudinal direction, and a ground connecting terminal provided on a longitudinal end of the ground wiring and exposed from the insulating layers. The signal connecting terminal and the ground connecting terminal are formed on an upper surface of the same insulating layer among the plurality of the insulating layers.

    摘要翻译： 布线电路板具有多个绝缘层，导电层具有沿纵向方向延伸并被绝缘层覆盖的信号布线，以及信号连接端子，设置在信号布线的纵向端并从绝缘层 以及接地层，其具有覆盖有绝缘层的接地布线，并且形成为围绕与纵向方向垂直的方向的信号布线;以及接地端子，其设置在接地布线的纵向端部并从绝缘体 层。 信号连接端子和接地连接端子形成在多个绝缘层中的相同绝缘层的上表面上。

    Wired circuit board and electronic device
    8.
    发明申请
    Wired circuit board and electronic device 失效
    有线电路板和电子设备

    公开(公告)号：US20080078573A1

    公开(公告)日：2008-04-03

    申请号：US11902553

    申请日：2007-09-24

    申请人： Szu-Han Hu ,  Voon Yee Ho ,  Hiroshi Yamazaki ,  Martin John McCaslin

    发明人： Szu-Han Hu ,  Voon Yee Ho ,  Hiroshi Yamazaki ,  Martin John McCaslin

    IPC分类号： H01R12/04

    CPC分类号： H05K1/0271 ,  H05K1/0219 ,  H05K1/028 ,  H05K1/148 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09563 ,  H05K2201/09809

    摘要： A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer.

    摘要翻译： 布线电路板具有沿纵向方向延伸的绝缘层，导电层具有覆盖有绝缘层的多个信号布线，并且沿垂直于纵向的方向以相互间隔开的平行关系布置，厚度方向 的绝缘层，以及设置在每个信号布线的两个纵向端并从绝缘层露出的连接端子，以及覆盖有绝缘层的接地层，并且形成为围绕每个信号布线沿垂直于 纵向。 在绝缘层中的每个信号布线之间形成沿着纵向的狭缝。

    Connecting configuration for flexible wired circuit board and electronic device
    9.
    发明申请
    Connecting configuration for flexible wired circuit board and electronic device 失效
    柔性布线电路板和电子设备的连接配置

    公开(公告)号：US20080182435A1

    公开(公告)日：2008-07-31

    申请号：US12010177

    申请日：2008-01-22

    申请人： Voon Yee Ho ,  Szu-Han Hu

    发明人： Voon Yee Ho ,  Szu-Han Hu

    IPC分类号： H01R12/00

    CPC分类号： H01R35/025 ,  H05K1/028 ,  H05K1/0281 ,  H05K2201/051 ,  H05K2201/09781 ,  H05K2201/2009

    摘要： A connecting configuration for a flexible wired circuit board includes a first terminal member, a second terminal member, and a flexible wired circuit board having a conductive pattern for electrically connecting the first terminal member and the second terminal member. The first terminal member and the second terminal member are provided such that at least one of the terminal members is linearly movable to be adjacent to and apart from the other terminal member. The flexible wired circuit board is provided to be wound or twisted in the middle of the moving direction.

    摘要翻译： 柔性布线电路板的连接结构包括第一端子构件，第二端子构件和具有用于电连接第一端子构件和第二端子构件的导电图案的柔性布线电路板。 第一端子构件和第二端子构件被设置成使得端子构件中的至少一个可线性地移动以与另一个端子构件相邻并分开。 柔性布线电路板被设置为在移动方向的中间被卷绕或扭曲。

    HEAT TRANSFER FOR A HARD-DRIVE WIRE-BOND PRE-AMP
    10.
    发明申请
    HEAT TRANSFER FOR A HARD-DRIVE WIRE-BOND PRE-AMP 审中-公开
    硬传动线束预热器的传输

    公开(公告)号：US20080088978A1

    公开(公告)日：2008-04-17

    申请号：US11548684

    申请日：2006-10-11

    申请人： Voon Yee Ho ,  Szu-Han Hu

    发明人： Voon Yee Ho ,  Szu-Han Hu

    IPC分类号： G11B5/55

    CPC分类号： G11B5/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： An actuator assembly for a hard disk drive having an actuator arm; a carrier plate of a thermally conductive material mounted onto the actuator arm; a circuitry substrate mounted onto the carrier plate, the substrate comprising a stiffener layer made of conductive material and electrical circuitry; a preamp wire-bond chip bonded to the stiffener layer and contact wires connected between the preamp and the electrical circuitry.

    摘要翻译： 一种用于具有致动器臂的硬盘驱动器的致动器组件; 安装在致动器臂上的导热材料的载板; 安装在所述载体板上的电路基板，所述基板包括由导电材料和电路制成的加强层; 接合到加强层的前置放大器引线接合芯片和连接在前置放大器和电路之间的接触导线。