发明申请
US20120021357A1 POSITIVE-TYPE PHOTOSENSITIVE INSULATING RESIN COMPOSITION, AND PATTERN FORMING METHOD USING SAME
审中-公开
正型型光敏绝缘树脂组合物和使用其的图案形成方法
- 专利标题: POSITIVE-TYPE PHOTOSENSITIVE INSULATING RESIN COMPOSITION, AND PATTERN FORMING METHOD USING SAME
- 专利标题(中): 正型型光敏绝缘树脂组合物和使用其的图案形成方法
-
申请号: US13146841申请日: 2010-01-29
-
公开(公告)号: US20120021357A1公开(公告)日: 2012-01-26
- 发明人: Katsumi Maeda , Shintaro Yamamichi
- 申请人: Katsumi Maeda , Shintaro Yamamichi
- 申请人地址: JP Tokyo
- 专利权人: NEC CORPORATION
- 当前专利权人: NEC CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2009-018193 20090129
- 国际申请: PCT/JP2010/000537 WO 20100129
- 主分类号: G03F7/20
- IPC分类号: G03F7/20 ; G03F7/028
摘要:
A photosensitive insulating resin composition, comprising a polymer, a photosensitizer, and an amide derivative that is expressed by the following general formula (1); (in formula (1), R1 represents a bivalent alkyl group, R2 represents a hydrocarbon group with a carbon number of 1 to 10, and R3 represents a hydrogen atom or an alkyl group with a carbon number of 1 to 4.)