发明申请
- 专利标题: SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- 专利标题(中): 半导体发光器件及其制造方法
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申请号: US13038154申请日: 2011-03-01
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公开(公告)号: US20120061712A1公开(公告)日: 2012-03-15
- 发明人: Kumi Masunaga , Ryota Kitagawa , Eishi Tsutsumi , Akira Fujimoto , Koji Asakawa , Takanobu Kamakura , Shinji Nunotani
- 申请人: Kumi Masunaga , Ryota Kitagawa , Eishi Tsutsumi , Akira Fujimoto , Koji Asakawa , Takanobu Kamakura , Shinji Nunotani
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 优先权: JP2010-202471 20100909
- 主分类号: H01L33/40
- IPC分类号: H01L33/40
摘要:
A semiconductor light emitting device includes a first semiconductor layer of a first conductivity type, a first electrode layer, a light emitting layer, a second semiconductor layer, a third semiconductor layer and a second electrode layer. The first electrode layer includes a metal portion having a plurality of opening portions. The opening portions penetrate the metal portion and have an equivalent circle diameter of a shape of the opening portions. The light emitting layer is between the first semiconductor layer and the first electrode layer. The second semiconductor layer of a second conductivity type is between the light emitting layer and the first electrode layer. The third semiconductor layer of a second conductivity type is between the second semiconductor layer and the first electrode layer. The second electrode layer is connected to the first semiconductor layer.
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