发明申请
- 专利标题： MULTIPLE BONDING IN WAFER LEVEL PACKAGING
- 专利标题（中）： 多级捆绑在水平包装中
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申请号： US12892003申请日： 2010-09-28
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公开(公告)号： US20120074590A1公开(公告)日： 2012-03-29
- 发明人: Chung-Hsien Lin , Chia-Hua Chu , Li-Cheng Chu , Yuan-Chih Hsieh , Chun-Wen Cheng
- 申请人： Chung-Hsien Lin , Chia-Hua Chu , Li-Cheng Chu , Yuan-Chih Hsieh , Chun-Wen Cheng
- 申请人地址： TW Hsin-Chu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/768
摘要：
The present disclosure provides a method for fabricating a MEMS device including multiple bonding of substrates. In an embodiment, a method includes providing a micro-electro-mechanical systems (MEMS) substrate including a first bonding layer, providing a semiconductor substrate including a second bonding layer, and providing a cap including a third bonding layer. The method further includes bonding the MEMS substrate to the semiconductor substrate at the first and second bonding layers, and bonding the cap to the semiconductor substrate at the second and third bonding layers to hermetically seal the MEMS substrate between the cap and the semiconductor substrate. A MEMS device fabricated by the above method is also provided.
公开/授权文献
- US08486744B2 Multiple bonding in wafer level packaging 公开/授权日：2013-07-16
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