发明申请
- 专利标题： ELECTRONIC PACKAGE STRUCTURE
- 专利标题（中）： 电子包装结构
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申请号： US13206810申请日： 2011-08-10
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公开(公告)号： US20120075808A1公开(公告)日： 2012-03-29
- 发明人: Han-Hsiang LEE , Yi-Cheng Lin , Pei-Chun Hung , Bau-Ru Lu , Da-Jung Chen , Jeng-Jen Li
- 申请人： Han-Hsiang LEE , Yi-Cheng Lin , Pei-Chun Hung , Bau-Ru Lu , Da-Jung Chen , Jeng-Jen Li
- 优先权： TW099132712 20100928
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H05K7/00
摘要：
An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.
公开/授权文献
- US08619428B2 Electronic package structure 公开/授权日：2013-12-31
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