发明申请
US20120080808A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE
审中-公开
粘合组合物，其制造方法，使用该粘合剂的胶片，用于安装半导体和半导体器件的基板
- 专利标题： ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE
- 专利标题（中）： 粘合组合物，其制造方法，使用该粘合剂的胶片，用于安装半导体和半导体器件的基板
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申请号： US13323113申请日： 2011-12-12
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公开(公告)号： US20120080808A1公开(公告)日： 2012-04-05
- 发明人: Teiichi Inada , Keiji Sumiya , Takeo Tomiyama , Tetsurou Iwakura , Hiroyuki Kawakami , Masao Suzuki , Takayuki Matsuzaki , Youichi Hosokawa , Keiichi Hatakeyama , Yasushi Shimada , Yuuko Tanaka , Hiroyuki Kuriya
- 申请人： Teiichi Inada , Keiji Sumiya , Takeo Tomiyama , Tetsurou Iwakura , Hiroyuki Kawakami , Masao Suzuki , Takayuki Matsuzaki , Youichi Hosokawa , Keiichi Hatakeyama , Yasushi Shimada , Yuuko Tanaka , Hiroyuki Kuriya
- 优先权： JP2000-41346 20000215; JP2000-349737 20001116; JP2000-349739 20001116
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
摘要：
Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.
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