发明申请
- 专利标题: VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD
- 专利标题(中): 真空加工设备和真空加工方法
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申请号: US13011041申请日: 2011-01-21
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公开(公告)号: US20120093617A1公开(公告)日: 2012-04-19
- 发明人: Yutaka Kudou , Hiroaki Takikawa , Takahiro Shimomura , Masakazu Isozaki , Takashi Uemura
- 申请人: Yutaka Kudou , Hiroaki Takikawa , Takahiro Shimomura , Masakazu Isozaki , Takashi Uemura
- 专利权人: Hitachi High-Technologies Corporation
- 当前专利权人: Hitachi High-Technologies Corporation
- 优先权: JP2010-233192 20101018
- 主分类号: H01L21/67
- IPC分类号: H01L21/67
摘要:
A vacuum processing apparatus including a processing chamber for processing a sample to be processed, a cooling chamber for cooling the high-temperature sample processed in the processing chamber, and a vacuum transfer chamber for establishing a connection between the processing chamber and the cooling chamber, a vacuum transfer robot equipped inside the vacuum transfer chamber, wherein the cooling chamber includes a gas-exhausting unit for reducing pressure inside the cooling chamber, a gas-supplying unit for supplying a gas into the cooling chamber, a pressure-controlling unit for controlling the pressure inside the cooling chamber, a supporting unit for supporting the high-temperature sample, and a mounting stage for proximity-holding the sample supported by the supporting unit, the mounting stage having a temperature-adjusting unit for adjusting the temperature of surface of the mounting stage into a temperature which is capable of cooling the high-temperature sample, the supporting unit having an ascending/descending-speed varying unit.
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