发明申请
US20120098078A1 BACKSIDE ILLUMINATED ACTIVE PIXEL SENSOR ARRAY, METHOD OF MANUFACTURING THE SAME, AND BACKSIDE ILLUMINATED IMAGE SENSOR INCLUDING THE SAME
有权
背面照明的有源像素传感器阵列,其制造方法和包括其的背面照明的图像传感器
- 专利标题: BACKSIDE ILLUMINATED ACTIVE PIXEL SENSOR ARRAY, METHOD OF MANUFACTURING THE SAME, AND BACKSIDE ILLUMINATED IMAGE SENSOR INCLUDING THE SAME
- 专利标题(中): 背面照明的有源像素传感器阵列,其制造方法和包括其的背面照明的图像传感器
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申请号: US13252560申请日: 2011-10-04
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公开(公告)号: US20120098078A1公开(公告)日: 2012-04-26
- 发明人: Eun-sub Shim , Jung-chak Ahn , Bum-suk Kim , Kyung-ho Lee
- 申请人: Eun-sub Shim , Jung-chak Ahn , Bum-suk Kim , Kyung-ho Lee
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2010-0104747 20101026
- 主分类号: H01L31/0232
- IPC分类号: H01L31/0232 ; H01L31/18
摘要:
A backside-illuminated active pixel sensor array in which crosstalk between adjacent pixels is prevented, a method of manufacturing the backside-illuminated active pixel sensor array, and a backside-illuminated image sensor including the backside-illuminated active pixel sensor array are provided. The backside-illuminated active pixel sensor array includes a semiconductor substrate of a first conductive type that comprises a front surface and a rear surface, light-receiving devices for generating charges in response to light incident via the rear surface, and one or more pixel isolating layers for forming boundaries between pixels by being disposed between the adjacent light-receiving devices, a wiring layer disposed on the front surface of the semiconductor substrate, and a light filter layer disposed on the rear surface of the semiconductor substrate, wherein a thickness of the one or more pixel isolating layers decreases from a point in the semiconductor substrate toward the rear surface.
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