发明申请
- 专利标题: SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- 专利标题(中): 半导体结构及其制造方法
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申请号: US13144182申请日: 2011-03-04
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公开(公告)号: US20120104495A1公开(公告)日: 2012-05-03
- 发明人: Huilong Zhu , Qingqing Liang , Haizhou Yin , Zhijiong Luo
- 申请人: Huilong Zhu , Qingqing Liang , Haizhou Yin , Zhijiong Luo
- 申请人地址: CN Beijing
- 专利权人: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- 当前专利权人: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- 当前专利权人地址: CN Beijing
- 优先权: CN201010527488.5 20101027
- 国际申请: PCT/CN11/71530 WO 20110304
- 主分类号: H01L29/772
- IPC分类号: H01L29/772 ; H01L21/336
摘要:
The present application discloses a semiconductor structure and a method for manufacturing the same. The semiconductor structure according to the present invention adjusts a threshold voltage with a common contact, which has a portion outside the source or drain region extending to the back-gate region and provides an electrical contact of the source or drain region and the back-gate region, which leads to a simple manufacturing process, an increased integration level and a lowered manufacture cost. Moreover, the asymmetric design of the back-gate structure further increases the threshold voltage and improves the performance of the device.
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