发明申请
- 专利标题: METHOD FOR MANUFACTURING GALLIUM NITRIDE CRYSTAL AND GALLIUM NITRIDE WAFER
- 专利标题(中): 制造氮化镓晶体和氮化铝膜的方法
-
申请号: US13402131申请日: 2012-02-22
-
公开(公告)号: US20120164058A1公开(公告)日: 2012-06-28
- 发明人: Tomoki UEMURA , Takashi SAKURADA , Shinsuke FUJIWARA , Takuji OKAHISA , Koji UEMATSU , Hideaki NAKAHATA
- 申请人: Tomoki UEMURA , Takashi SAKURADA , Shinsuke FUJIWARA , Takuji OKAHISA , Koji UEMATSU , Hideaki NAKAHATA
- 专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 优先权: JPP2006-126039 20060428
- 主分类号: C01B21/06
- IPC分类号: C01B21/06 ; C30B19/12 ; C30B23/02
摘要:
There is provided a method for fabricating a gallium nitride crystal with low dislocation density, high crystallinity, and resistance to cracking during polishing of sliced pieces by growing the gallium nitride crystal using a gallium nitride substrate including dislocation-concentrated regions or inverted-polarity regions as a seed crystal substrate. Growing a gallium nitride crystal 79 at a growth temperature higher than 1,100° C. and equal to or lower than 1,300° C. so as to bury dislocation-concentrated regions or inverted-polarity regions 17a reduces dislocations inherited from the dislocation-concentrated regions or inverted regions 17a, thus preventing new dislocations from occurring over the dislocation-concentrated regions or inverted-polarity regions 17a. This also increases the crystallinity of the gallium nitride crystal 79 and its resistance to cracking during the polishing.
信息查询