发明申请
US20120211764A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
审中-公开
半导体器件及制造半导体器件的方法
- 专利标题： SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体器件及制造半导体器件的方法
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申请号： US13359855申请日： 2012-01-27
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公开(公告)号： US20120211764A1公开(公告)日： 2012-08-23
- 发明人: Keishiro OKAMOTO , Tadahiro IMADA , Nobuhiro IMAIZUMI , Keiji WATANABE
- 申请人： Keishiro OKAMOTO , Tadahiro IMADA , Nobuhiro IMAIZUMI , Keiji WATANABE
- 申请人地址： JP Kawasaki
- 专利权人： FUJITSU LIMITED,
- 当前专利权人： FUJITSU LIMITED,
- 当前专利权人地址： JP Kawasaki
- 优先权： JP2011-036273 20110222
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/60 ; H01L29/20
摘要：
A semiconductor device includes: a support base material, and a semiconductor element bonded to the support base material with a binder, the binder including: a porous metal material that contacts the support base material and the semiconductor element, and a solder that is filled in at least one part of pores of the porous metal material.
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