发明申请
US20120235289A1 POWER DEVICE WITH BOTTOM SOURCE ELECTRODE AND PREPARATION METHOD 有权
具有底部电源电极的电源装置和制备方法

POWER DEVICE WITH BOTTOM SOURCE ELECTRODE AND PREPARATION METHOD
摘要:
A power semiconductor package has an ultra thin chip with front side molding to reduce substrate resistance; a lead frame unit with grooves located on both side leads provides precise positioning for connecting numerous bridge-shaped metal clips to the front side of the side leads. The bridge-shaped metal clips are provided with bridge structure and half or fully etched through holes for relieving superfluous solder during manufacturing process.
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