发明申请
US20120250351A1 LIGHT EMITTING DIODE PACKAGE, METHOD OF FABRICATING THE SAME, AND DISPLAY APPARATUS HAVING THE SAME
有权
发光二极管封装，其制造方法和具有该发光二极管封装的显示装置
- 专利标题： LIGHT EMITTING DIODE PACKAGE, METHOD OF FABRICATING THE SAME, AND DISPLAY APPARATUS HAVING THE SAME
- 专利标题（中）： 发光二极管封装，其制造方法和具有该发光二极管封装的显示装置
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申请号： US13231816申请日： 2011-09-13
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公开(公告)号： US20120250351A1公开(公告)日： 2012-10-04
- 发明人: Myeong-Ju Shin , Jaewoo Jung , YoungSic Kim , Seung Hwan Baek , Yeongbae Lee
- 申请人： Myeong-Ju Shin , Jaewoo Jung , YoungSic Kim , Seung Hwan Baek , Yeongbae Lee
- 优先权： KR10-2011-0029801 20110331
- 主分类号： G09F13/04
- IPC分类号： G09F13/04 ; F21V9/08 ; F21V8/00 ; H01L33/06 ; H01L33/50
摘要：
A light emitting diode package, a method of fabricating the same, and a display apparatus having the same are provided. The light emitting diode package includes a light emitting diode, a quantum dot layer, a band pass filter, disposed in a housing. The light emitting diode emits light of a first color. The quantum dot layer includes a plurality of quantum dots disposed on the light emitting diode to absorb a portion of the light emitted by the diode, and then emit light of a second color. The band pass filter is disposed on the quantum dot layer and has a first pass band corresponding to the light emitted from the diode and a second pass band corresponding to the light emitted from the quantum dots.