Invention Application
US20120308740A1 Beam-Induced Deposition of Low-Resistivity Material 审中-公开
光诱导沉积低电阻材料

Beam-Induced Deposition of Low-Resistivity Material
Abstract:
An improved method of beam deposition to deposit a low-resistivity metal. Preferred embodiments of the present invention use a novel focused ion beam induced deposition precursor to deposit low-resistivity metallic material such as tin. Applicants have discovered that by using a methylated or ethylated metal such as hexamethylditin as a precursor, material can be deposited having a resistivity as low as 40 μΩ·cm.
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