Invention Application
- Patent Title: Beam-Induced Deposition of Low-Resistivity Material
- Patent Title (中): 光诱导沉积低电阻材料
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Application No.: US13351088Application Date: 2012-01-16
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Publication No.: US20120308740A1Publication Date: 2012-12-06
- Inventor: Steven Randolph , Clive D. Chandler
- Applicant: Steven Randolph , Clive D. Chandler
- Applicant Address: US OR Hillsboro
- Assignee: FEI COMPANY
- Current Assignee: FEI COMPANY
- Current Assignee Address: US OR Hillsboro
- Main IPC: C23C16/50
- IPC: C23C16/50

Abstract:
An improved method of beam deposition to deposit a low-resistivity metal. Preferred embodiments of the present invention use a novel focused ion beam induced deposition precursor to deposit low-resistivity metallic material such as tin. Applicants have discovered that by using a methylated or ethylated metal such as hexamethylditin as a precursor, material can be deposited having a resistivity as low as 40 μΩ·cm.
Public/Granted literature
- US09090973B2 Beam-induced deposition of low-resistivity material Public/Granted day:2015-07-28
Information query
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