发明申请
US20130005143A1 METHOD AND APPARATUS PROVIDING AIR-GAP INSULATION BETWEEN ADJACENT CONDUCTORS USING NANOPARTICLES
有权
在使用纳米颗粒的相邻导体之间提供空气隙绝缘的方法和装置
- 专利标题： METHOD AND APPARATUS PROVIDING AIR-GAP INSULATION BETWEEN ADJACENT CONDUCTORS USING NANOPARTICLES
- 专利标题（中）： 在使用纳米颗粒的相邻导体之间提供空气隙绝缘的方法和装置
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申请号： US13616080申请日： 2012-09-14
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公开(公告)号： US20130005143A1公开(公告)日： 2013-01-03
- 发明人: Nishant Sinha , Gurtej Sandhu , Neil Greeley , John Smythe
- 申请人： Nishant Sinha , Gurtej Sandhu , Neil Greeley , John Smythe
- 主分类号： H01L21/28
- IPC分类号： H01L21/28 ; B82Y40/00
摘要：
A semiconductor device and a method of forming it are disclosed in which at least two adjacent conductors have an air-gap insulator between them which is covered by nanoparticles of insulating material being a size which prevent the nanoparticles from substantially entering into the air-gap.
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