发明申请
- 专利标题： SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- 专利标题（中）： 基板加工方法和基板加工装置
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申请号： US13541167申请日： 2012-07-03
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公开(公告)号： US20130008868A1公开(公告)日： 2013-01-10
- 发明人: Yoshihiro UOZUMI , Shinsuke Kimura , Yoshihiro Ogawa , Hiroyasu Iimori , Tatsuhiko Koide , Hideaki Hirabayashi , Yuji Nagashima
- 申请人： Yoshihiro UOZUMI , Shinsuke Kimura , Yoshihiro Ogawa , Hiroyasu Iimori , Tatsuhiko Koide , Hideaki Hirabayashi , Yuji Nagashima
- 优先权： JP2011-149367 20110705
- 主分类号： B08B3/00
- IPC分类号： B08B3/00 ; B05C11/00 ; B08B7/00 ; B44C1/22
摘要：
According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.