Invention Application
- Patent Title: PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION THEREOF
- Patent Title (中): 光敏树脂组合物及其应用
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Application No.: US13546116Application Date: 2012-07-11
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Publication No.: US20130021543A1Publication Date: 2013-01-24
- Inventor: Chih-Hung LIN , Chia-Hui YU
- Applicant: Chih-Hung LIN , Chia-Hui YU
- Applicant Address: TW Tainan City
- Assignee: CHI MEI CORPORATION
- Current Assignee: CHI MEI CORPORATION
- Current Assignee Address: TW Tainan City
- Priority: TW100125653 20110720
- Main IPC: C08L47/00
- IPC: C08L47/00 ; G02F1/1333 ; C08F236/20

Abstract:
A photosensitive resin composition includes: a copolymer obtained by subjecting a conjugated diene polymer having a (meth)acryloyl group, a conjugated diene monomer, and a (meth)acrylic acid monomer to copolymerization; a compound having at least one ethylenically unsaturated group; and a photoinitiator. The copolymer contains 60 wt % to 99 wt % of a copolymer fraction having a molecular weight ranging from 30,000 to 900,000, and 1 wt % to 22 wt % of a copolymer fraction having a molecular weight ranging from 1,000 to 10,000 when calculated from an integral molecular weight distribution curve obtained by plotting cumulative weight percentage versus molecular weight falling within a range between 1,000 and 1,000,000 measured by gel permeation chromatography.
Public/Granted literature
- US1228129A Latch. Public/Granted day:1917-05-29
Information query