Invention Application
- Patent Title: SELF-ALIGNING CONDUCTIVE BUMP STRUCTURE AND METHOD OF MAKING THE SAME
- Patent Title (中): 自调节导电阻尼结构及其制造方法
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Application No.: US13192756Application Date: 2011-07-28
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Publication No.: US20130026620A1Publication Date: 2013-01-31
- Inventor: Cheng-Lin HUANG , I-Ting CHEN , Ying Ching SHIH , Po-Hao TSAI , Szu Wei LU , Jing-Cheng LIN , Shin-Puu JENG , Chen-Hua YU
- Applicant: Cheng-Lin HUANG , I-Ting CHEN , Ying Ching SHIH , Po-Hao TSAI , Szu Wei LU , Jing-Cheng LIN , Shin-Puu JENG , Chen-Hua YU
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/60
Abstract:
The disclosure relates to a conductive bump structure of a semiconductor device. An exemplary structure for a semiconductor device comprises a substrate comprising a major surface and conductive bumps distributed over the major surface of the substrate. Each of a first subset of the conductive bumps comprise a regular body, and each of a second subset of the conductive bumps comprise a ring-shaped body.
Public/Granted literature
- US09024438B2 Self-aligning conductive bump structure and method of making the same Public/Granted day:2015-05-05
Information query
IPC分类:
