发明申请
- 专利标题: THIN FILM ELECTRODE CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- 专利标题(中): 薄膜电极陶瓷基板及其制造方法
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申请号: US13548575申请日: 2012-07-13
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公开(公告)号: US20130032383A1公开(公告)日: 2013-02-07
- 发明人: Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yun Hwi Park
- 申请人: Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yun Hwi Park
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2011-0078188 20110805
- 主分类号: H05K1/03
- IPC分类号: H05K1/03 ; B05D3/10
摘要:
Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.