摘要:
Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; a thin film electrode pattern formed on the ceramic substrate; and a plating layer formed on the thin film electrode pattern, wherein the plating layer is formed above the thin film electrode pattern and on both lateral surfaces of the thin film electrode pattern. According to the present invention, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented, by forming a plating layer above the thin film electrode pattern or on both lateral surfaces of the thin film electrode pattern, or forming an intaglio type anti-etching metal layer in the surface of the ceramic substrate.
摘要:
Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.
摘要:
Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.
摘要:
Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired.
摘要:
There is provided a method of manufacturing a multilayer ceramic substrate, the method including: providing a non-sintered multilayer ceramic substrate having a plurality of low temperature sintering green sheets laminated therein; disposing a hard-to-sinter constraining green sheet on at least one of top and bottom surfaces of the non-sintered multilayer ceramic substrate; sintering the non-sintered multilayer ceramic substrate having the hard-to-sinter constraining layer disposed thereon; immersing the sintered multilayer ceramic substrate into an acidic solution; and activating a contact between the hard-to-sinter constraining layer and the acidic solution such that the hard-to-sinter constraining layer is removed.
摘要:
A method for manufacturing a ceramic green sheet includes providing a stamp having an imprinting surface on which a raised structure corresponding to a circuit pattern is formed, imprinting the stamp on the ceramic green sheet to form a depressed pattern in the ceramic green sheet, the depressed pattern being transferred from the raised structure, curing the ceramic green sheet with the stamp imprinted on the ceramic green sheet, separating the stamp from the ceramic green sheet, and providing the depressed pattern of the ceramic green sheet with the conductive material.
摘要:
An LTCC module includes an LTCC substrate and a pad part formed on an undersurface of the LTCC substrate for mounting the LTCC substrate to an external substrate. The pad part includes a metal pad layer formed on an undersurface of the LTCC substrate and a solder layer formed on an undersurface of the metal pad layer.
摘要:
The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.
摘要:
The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.