公开(公告)号：US20120037610A1

公开(公告)日：2012-02-16

申请号：US12985001

申请日：2011-01-05

Applicant: Won Hee YOO ,  Byeung Gyu CHANG ,  Yun Hwi PARK

Inventor： Won Hee YOO ,  Byeung Gyu CHANG ,  Yun Hwi PARK

IPC: F27B14/06

CPC classification number: F27B17/0041 ,  F27B5/06 ,  F27B5/16 ,  F27B17/0075 ,  F27B2005/165

Abstract: A ceramic firing furnace is provided. A uniform gas atmosphere is formed in the ceramic firing furnace to thus minimize a defective ceramic substrate when the ceramic substrate is fired. The ceramic firing furnace includes: a case having an internal space in which a shaped body is disposed; a heating element disposed in the interior of the case and radiating heat; and a plurality of air supply units fastened through the case such that the plurality of air supply units are rotatable by an external force, and supplying a gas to the internal space of the case.

Abstract translation: 提供陶瓷烧制炉。 在陶瓷烧制炉中形成均匀的气体气氛，从而使陶瓷基板烧成时的陶瓷基板不良。 陶瓷烧制炉包括：具有内部空间的壳体，成形体设置在该内部空间中; 设置在壳体内部并辐射热量的加热元件; 以及多个空气供给单元，其通过所述壳体紧固，使得所述多个供气单元能够通过外力旋转，并且将气体供应到所述壳体的内部空间。

公开(公告)号：US20110011631A1

公开(公告)日：2011-01-20

申请号：US12585006

申请日：2009-08-31

Applicant: Won Hee YOO ,  Byeung Gyu CHANG ,  Yong Suk KIM

Inventor： Won Hee YOO ,  Byeung Gyu CHANG ,  Yong Suk KIM

IPC: H05K1/09 ,  B05D5/12 ,  H05K1/03

CPC classification number: H05K3/4007 ,  H05K1/0306 ,  H05K3/248 ,  H05K3/38 ,  H05K2203/0278 ,  H05K2203/1476

Abstract: The present invention relates to a ceramic substrate and a method of manufacturing the same. The ceramic substrate includes: a ceramic base; an electrode pattern formed on at least one surface of the ceramic base at predetermined internal and external depths; and electrode material filled in the inside of the electrode pattern. The method of manufacturing the ceramic substrate includes: coating first electrode material on at least one surface of a ceramic base; forming a surface layer built-in electrode pattern by pressurizing the coated first electrode material; primarily firing the ceramic base on which the surface layer built-in electrode pattern is formed; coating second electrode material on the surface layer built-in electrode pattern; and secondarily firing the ceramic base on which the second electrode material is coated.

Abstract translation: 陶瓷基板及其制造方法技术领域本发明涉及陶瓷基板及其制造方法。 陶瓷基板包括：陶瓷基体; 在预定的内部和外部深度形成在所述陶瓷基体的至少一个表面上的电极图案; 以及填充在电极图案内部的电极材料。 制造陶瓷基板的方法包括：在陶瓷基体的至少一个表面上涂覆第一电极材料; 通过对所涂覆的第一电极材料进行加压来形成表面层内置的电极图案; 主要烧制形成表面层内置电极图案的陶瓷基底; 在表面层上涂覆第二电极材料内置的电极图案; 并二次烧制涂覆有第二电极材料的陶瓷基底。

公开(公告)号：US20100301009A1

公开(公告)日：2010-12-02

申请号：US12458834

申请日：2009-07-23

Applicant: Won Hee Yoo ,  Byeung Gyu Chang ,  Yong Suk Kim

Inventor： Won Hee Yoo ,  Byeung Gyu Chang ,  Yong Suk Kim

IPC: C23F1/00

CPC classification number: G01R3/00 ,  G01R1/06761 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/143 ,  H05K3/388

Abstract: The present invention relates to a method for forming electrode patterns of a ceramic substrate including the steps of: forming a plurality of conductive adhesion patterns on the ceramic substrate to be separated apart from one another; forming a plating seed layer, covering the conductive adhesion patterns, on the ceramic substrate; forming photoresist patterns, exposing parts corresponding to the conductive adhesion patterns, on the plating seed layer; forming a plating layer on the plating seed layer exposed by the photoresist patterns; removing the photoresist patterns; and etching parts of the plating seed layer exposed by removal of the photoresist patterns.

Abstract translation: 本发明涉及一种形成陶瓷基板的电极图案的方法，包括以下步骤：在陶瓷基板上形成多个导电粘合图案以彼此分开; 在陶瓷基板上形成覆盖导电粘合图案的电镀种子层; 在电镀种子层上形成光致抗蚀剂图案，暴露与导电粘合图案相对应的部分; 在由光致抗蚀剂图案曝光的电镀种子层上形成镀层; 去除光致抗蚀剂图案; 以及通过去除光致抗蚀剂图案来蚀刻暴露的电镀种子层的部分。

公开(公告)号：US20090294297A1

公开(公告)日：2009-12-03

申请号：US12243067

申请日：2008-10-01

Applicant: Young Suk KIM ,  Yong Soo Oh ,  Byeung Gyu Chang ,  Won Hee Yoo ,  Sung Yeol Park

Inventor： Young Suk KIM ,  Yong Soo Oh ,  Byeung Gyu Chang ,  Won Hee Yoo ,  Sung Yeol Park

IPC: C25D5/10

CPC classification number: C25D5/022 ,  C25D5/12 ,  H05K1/0306 ,  H05K3/0076 ,  H05K3/108 ,  H05K2201/0129 ,  H05K2203/1105

Abstract: There is provided a method of forming a plating layer, the method including: forming a seed layer on a substrate; forming a pattern layer on the seed layer, the pattern layer formed of a thermoplastic resin and including openings; forming a plating layer on portions of the seed layer corresponding to the openings; and removing the pattern layer. This method ensures that the plating layer is formed with a sufficient thickness and the substrate, particularly, a ceramic substrate suffers minimal chemical damage during a plating process. Moreover, the plating layer is formed with a more uniform thickness.

Abstract translation: 提供了形成镀层的方法，该方法包括：在基板上形成种子层; 在种子层上形成图案层，所述图案层由热塑性树脂形成并包括开口; 在对应于开口的种子层的部分上形成镀层; 并去除图案层。 该方法确保镀层形成足够的厚度，并且衬底，特别是陶瓷衬底在电镀过程中遭受最小的化学损伤。 此外，镀层形成为更均匀的厚度。

公开(公告)号：US09101064B2

公开(公告)日：2015-08-04

申请号：US13548575

申请日：2012-07-13

Applicant: Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yun Hwi Park

Inventor： Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yun Hwi Park

IPC: H05K1/03 ,  H05K1/09 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10

CPC classification number: H05K3/06 ,  H05K1/03 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/02 ,  H05K3/107 ,  H05K2201/0317 ,  H05K2203/025

Abstract: Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.

Abstract translation: 本文公开了一种薄膜电极陶瓷基板及其制造方法。 薄膜电极陶瓷基板包括：陶瓷基板; 形成在陶瓷基板的表面上的一个或多个抗蚀刻金属层; 在抗蚀刻金属层上形成的薄膜电极图案; 以及形成在薄膜电极图案上的镀层，其中薄膜电极图案的各个边缘部分与抗蚀刻金属层接触，因此在陶瓷基板的表面和薄膜之间发生切削缺陷 可以防止由于蚀刻剂引起的薄膜电极图案之间的电极图案和薄膜电极图案之间的粘合强度，从而确保薄膜电极图案的耐久性和可靠性。

公开(公告)号：US20130032384A1

公开(公告)日：2013-02-07

申请号：US13565249

申请日：2012-08-02

Applicant: Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yun Hwi Park

Inventor： Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yun Hwi Park

IPC: H05K1/03 ,  H05K3/22

CPC classification number: H05K3/243 ,  H05K1/0306 ,  H05K3/107 ,  H05K3/108 ,  H05K2201/0338

Abstract: Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; a thin film electrode pattern formed on the ceramic substrate; and a plating layer formed on the thin film electrode pattern, wherein the plating layer is formed above the thin film electrode pattern and on both lateral surfaces of the thin film electrode pattern. According to the present invention, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented, by forming a plating layer above the thin film electrode pattern or on both lateral surfaces of the thin film electrode pattern, or forming an intaglio type anti-etching metal layer in the surface of the ceramic substrate.

Abstract translation: 本文公开了一种薄膜电极陶瓷基板及其制造方法。 薄膜电极陶瓷基板包括：陶瓷基板; 形成在陶瓷基板上的薄膜电极图案; 以及形成在所述薄膜电极图案上的镀层，其中所述镀层形成在所述薄膜电极图案的上方以及所述薄膜电极图案的两个侧面上。 根据本发明，通过在薄膜电极图案上方形成镀层，可以防止在陶瓷基板的表面与薄膜电极图案之间以及由于蚀刻剂引起的薄膜电极图案之间发生的底切缺陷，或 在薄膜电极图案的两个侧表面上，或在陶瓷基板的表面中形成凹版型的抗蚀刻金属层。

公开(公告)号：US20130017504A1

公开(公告)日：2013-01-17

申请号：US13473215

申请日：2012-05-16

Applicant: Won Hee YOO ,  Yun Hwi PARK ,  Byeung Gyu CHANG

Inventor： Won Hee YOO ,  Yun Hwi PARK ,  Byeung Gyu CHANG

IPC: F27D19/00 ,  F27D21/04

CPC classification number: H01L21/67248 ,  F27B2005/143 ,  F27D21/0014 ,  F27D2019/0025 ,  H01L21/67109

Abstract: Disclosed herein is a furnace, including: a body having a space formed therein; a plurality of thermocouples disposed in the body and vertically movably coupled with the body; a plurality of heating elements dispose in the body; and a control unit that receives temperature data from the thermocouples to control temperature of the heating elements, whereby the furnace can measure and control the temperature for each portion of the internal space to form uniform temperature distribution, in particular, make temperature distribution of the heat applied to the fired matter uniform to obtain high-quality fired matter.

Abstract translation: 本文公开了一种炉，包括：具有形成在其中的空间的主体; 多个热电偶，其布置在所述主体中并与所述主体垂直地可移动地联接; 多个加热元件配置在体内; 以及控制单元，其接收来自热电偶的温度数据以控制加热元件的温度，由此炉子可以测量和控制内部空间的每个部分的温度，以形成均匀的温度分布，特别是使得热量的温度分布 适用于烧制物均匀，以获得高品质的发射物质。

公开(公告)号：US08106306B2

公开(公告)日：2012-01-31

申请号：US12405729

申请日：2009-03-17

Applicant: Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yong Suk Kim

Inventor： Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yong Suk Kim

IPC: H05K1/00

CPC classification number: H05K3/4629 ,  B32B18/00 ,  C04B37/005 ,  C04B2237/04 ,  C04B2237/32 ,  C04B2237/52 ,  C04B2237/562 ,  C04B2237/565 ,  C04B2237/595 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/708 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/4617 ,  H05K2201/0195 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/1126 ,  H05K2203/1476

Abstract: Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired.

Abstract translation: 提供一种制造陶瓷多层电路基板的方法。 形成多个陶瓷块，每个陶瓷块中的一个或多个具有通孔电极的陶瓷生片分别彼此层叠，然后烧制。 烧制的陶瓷块彼此对准。 制备一个或多个接合生片，每个接合生片具有与陶瓷块的通孔电极对应的位置的接合电极。 每个接合生片被插入在彼此相对的一对陶瓷块之间。 陶瓷块和接合生片结合，然后烧制。

公开(公告)号：US20110148447A1

公开(公告)日：2011-06-23

申请号：US12836955

申请日：2010-07-15

Applicant: Won Hee YOO ,  Byeung Gyu Chang ,  Yong Suk Kim

Inventor： Won Hee YOO ,  Byeung Gyu Chang ,  Yong Suk Kim

IPC: G01R1/067 ,  C04B35/74 ,  H05K1/11

CPC classification number: B32B18/00 ,  C04B35/63436 ,  C04B35/63456 ,  C04B37/026 ,  C04B2237/04 ,  C04B2237/12 ,  C04B2237/32 ,  C04B2237/40 ,  C04B2237/52 ,  C04B2237/592 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/72 ,  G01R1/06711 ,  G01R3/00 ,  H05K3/4007 ,  H05K3/4046 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/0367 ,  H05K2203/025

Abstract: There are provided a multilayer ceramic substrate and a probe board formed using a pillar-type conductor formed by including preparing a ceramic sheet having at least one through hole; filling the inside of the through hole with a conductive material; firing the ceramic sheet so that the conductive material is fired to form a pillar-type conductor; and removing the ceramic sheet so that the pillar-type conductor remains, and fabricating methods of the same. The multilayer ceramic substrate and the probe board use the pillar-type conductor that can fill the unfilled region formed within the ceramic sintered body, such that the electrical characteristics and surface flatness thereof are improved. In addition, the multilayer ceramic substrate and the probe board formed by using the pillar-type conductor with the improved adhesion and electrical characteristics between the ceramic sintered body and the connecting pad, and the fabricating methods of the same are provided.

Abstract translation: 提供了一种多层陶瓷基板和使用柱状导体形成的探针板，所述柱状导体通过包括制备具有至少一个通孔的陶瓷片而形成; 用导电材料填充通孔的内部; 烧制陶瓷片，使得导电材料被烧制以形成柱状导体; 并且去除陶瓷片以使柱状导体残留，并且制造其方法。 多层陶瓷基板和探针板使用可以填充陶瓷烧结体内形成的未填充区域的柱状导体，使得其电特性和表面平坦性得到改善。 此外，提供了通过使用具有改善的陶瓷烧结体和连接焊盘之间的粘合性和电特性的柱状导体形成的多层陶瓷基板和探针板及其制造方法。

公开(公告)号：US20100300733A1

公开(公告)日：2010-12-02

申请号：US12458780

申请日：2009-07-22

Applicant: Yong Suk Kim ,  Byeung Gyu Chang ,  Won Hee Yoo ,  Yong Soo Oh

Inventor： Yong Suk Kim ,  Byeung Gyu Chang ,  Won Hee Yoo ,  Yong Soo Oh

IPC: H05K1/09 ,  B05D5/12 ,  B32B38/00

CPC classification number: H05K3/28 ,  C04B37/006 ,  C04B2237/125 ,  C04B2237/365 ,  C04B2237/62 ,  H05K1/0269 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/108 ,  H05K3/388 ,  H05K3/4629 ,  H05K2201/0112 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2203/1383 ,  H05K2203/166

Abstract: The present invention relates to a multilayer ceramic board and manufacturing method thereof. The multilayer ceramic board includes: a ceramic stacked structure in which multiple ceramic layers are stacked and interconnected to one another through vias; diffused reflection preventing patterns which expose the vias provided on each of the uppermost ceramic layer and the lowermost ceramic layer, and are disposed on each of a top surface and a bottom surface of the ceramic stacked structure; and contact pads which are electrically connected to the vias exposed by the diffused reflection preventing patterns.

Abstract translation: 本发明涉及一种多层陶瓷板及其制造方法。 多层陶瓷板包括：陶瓷层叠结构，其中多个陶瓷层通过通孔彼此堆叠并彼此互连; 扩散反射防止图案，其暴露设置在最上层陶瓷层和最下层陶瓷层中的每一个上的通孔，并且设置在陶瓷堆叠结构的顶表面和底表面中的每一个上; 以及电连接到由扩散反射防止图案暴露的通孔的接触焊盘。