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    THIN FILM ELECTRODE CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明申请
    THIN FILM ELECTRODE CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    薄膜电极陶瓷基板及其制造方法

    公开(公告)号：US20130032384A1

    公开(公告)日：2013-02-07

    申请号：US13565249

    申请日：2012-08-02

    申请人： Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yun Hwi Park

    发明人： Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yun Hwi Park

    IPC分类号： H05K1/03 ,  H05K3/22

    CPC分类号： H05K3/243 ,  H05K1/0306 ,  H05K3/107 ,  H05K3/108 ,  H05K2201/0338

    摘要： Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; a thin film electrode pattern formed on the ceramic substrate; and a plating layer formed on the thin film electrode pattern, wherein the plating layer is formed above the thin film electrode pattern and on both lateral surfaces of the thin film electrode pattern. According to the present invention, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented, by forming a plating layer above the thin film electrode pattern or on both lateral surfaces of the thin film electrode pattern, or forming an intaglio type anti-etching metal layer in the surface of the ceramic substrate.

    摘要翻译： 本文公开了一种薄膜电极陶瓷基板及其制造方法。 薄膜电极陶瓷基板包括：陶瓷基板; 形成在陶瓷基板上的薄膜电极图案; 以及形成在所述薄膜电极图案上的镀层，其中所述镀层形成在所述薄膜电极图案的上方以及所述薄膜电极图案的两个侧面上。 根据本发明，通过在薄膜电极图案上方形成镀层，可以防止在陶瓷基板的表面与薄膜电极图案之间以及由于蚀刻剂引起的薄膜电极图案之间发生的底切缺陷，或 在薄膜电极图案的两个侧表面上，或在陶瓷基板的表面中形成凹版型的抗蚀刻金属层。

    Thin film electrode ceramic substrate and method for manufacturing the same
    2.
    发明授权
    Thin film electrode ceramic substrate and method for manufacturing the same 有权
    薄膜电极陶瓷基板及其制造方法

    公开(公告)号：US09101064B2

    公开(公告)日：2015-08-04

    申请号：US13548575

    申请日：2012-07-13

    申请人： Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yun Hwi Park

    发明人： Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yun Hwi Park

    IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10

    CPC分类号： H05K3/06 ,  H05K1/03 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/02 ,  H05K3/107 ,  H05K2201/0317 ,  H05K2203/025

    摘要： Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.

    摘要翻译： 本文公开了一种薄膜电极陶瓷基板及其制造方法。 薄膜电极陶瓷基板包括：陶瓷基板; 形成在陶瓷基板的表面上的一个或多个抗蚀刻金属层; 在抗蚀刻金属层上形成的薄膜电极图案; 以及形成在薄膜电极图案上的镀层，其中薄膜电极图案的各个边缘部分与抗蚀刻金属层接触，因此在陶瓷基板的表面和薄膜之间发生切削缺陷 可以防止由于蚀刻剂引起的薄膜电极图案之间的电极图案和薄膜电极图案之间的粘合强度，从而确保薄膜电极图案的耐久性和可靠性。

    THIN FILM ELECTRODE CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    THIN FILM ELECTRODE CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 有权
    薄膜电极陶瓷基板及其制造方法

    公开(公告)号：US20130032383A1

    公开(公告)日：2013-02-07

    申请号：US13548575

    申请日：2012-07-13

    申请人： Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yun Hwi Park

    发明人： Won Hee Yoo ,  Byeung Gyu Chang ,  Taek Jung Lee ,  Yun Hwi Park

    IPC分类号： H05K1/03 ,  B05D3/10

    CPC分类号： H05K3/06 ,  H05K1/03 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/02 ,  H05K3/107 ,  H05K2201/0317 ,  H05K2203/025

    摘要： Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.

    摘要翻译： 本文公开了一种薄膜电极陶瓷基板及其制造方法。 薄膜电极陶瓷基板包括：陶瓷基板; 形成在陶瓷基板的表面上的一个或多个抗蚀刻金属层; 在抗蚀刻金属层上形成的薄膜电极图案; 以及形成在薄膜电极图案上的镀层，其中薄膜电极图案的各个边缘部分与抗蚀刻金属层接触，因此在陶瓷基板的表面和薄膜之间发生切削缺陷 可以防止由于蚀刻剂引起的薄膜电极图案之间的电极图案和薄膜电极图案之间的粘合强度，从而确保薄膜电极图案的耐久性和可靠性。

    MULTILAYER CERAMIC SUBSTRATE AND PROBE BOARD USING PILLAR-TYPE CONDUCTOR AND FABRICATING METHODS OF THE SAME
    5.
    发明申请
    MULTILAYER CERAMIC SUBSTRATE AND PROBE BOARD USING PILLAR-TYPE CONDUCTOR AND FABRICATING METHODS OF THE SAME 审中-公开
    多层陶瓷基板和探针板使用支柱导体及其制作方法

    公开(公告)号：US20110148447A1

    公开(公告)日：2011-06-23

    申请号：US12836955

    申请日：2010-07-15

    申请人： Won Hee YOO ,  Byeung Gyu Chang ,  Yong Suk Kim

    发明人： Won Hee YOO ,  Byeung Gyu Chang ,  Yong Suk Kim

    IPC分类号： G01R1/067 ,  C04B35/74 ,  H05K1/11

    CPC分类号： B32B18/00 ,  C04B35/63436 ,  C04B35/63456 ,  C04B37/026 ,  C04B2237/04 ,  C04B2237/12 ,  C04B2237/32 ,  C04B2237/40 ,  C04B2237/52 ,  C04B2237/592 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/72 ,  G01R1/06711 ,  G01R3/00 ,  H05K3/4007 ,  H05K3/4046 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/0367 ,  H05K2203/025

    摘要： There are provided a multilayer ceramic substrate and a probe board formed using a pillar-type conductor formed by including preparing a ceramic sheet having at least one through hole; filling the inside of the through hole with a conductive material; firing the ceramic sheet so that the conductive material is fired to form a pillar-type conductor; and removing the ceramic sheet so that the pillar-type conductor remains, and fabricating methods of the same. The multilayer ceramic substrate and the probe board use the pillar-type conductor that can fill the unfilled region formed within the ceramic sintered body, such that the electrical characteristics and surface flatness thereof are improved. In addition, the multilayer ceramic substrate and the probe board formed by using the pillar-type conductor with the improved adhesion and electrical characteristics between the ceramic sintered body and the connecting pad, and the fabricating methods of the same are provided.

    摘要翻译： 提供了一种多层陶瓷基板和使用柱状导体形成的探针板，所述柱状导体通过包括制备具有至少一个通孔的陶瓷片而形成; 用导电材料填充通孔的内部; 烧制陶瓷片，使得导电材料被烧制以形成柱状导体; 并且去除陶瓷片以使柱状导体残留，并且制造其方法。 多层陶瓷基板和探针板使用可以填充陶瓷烧结体内形成的未填充区域的柱状导体，使得其电特性和表面平坦性得到改善。 此外，提供了通过使用具有改善的陶瓷烧结体和连接焊盘之间的粘合性和电特性的柱状导体形成的多层陶瓷基板和探针板及其制造方法。

    Probe substrate with auxiliary contact pads and probe card therewith
    7.
    发明授权
    Probe substrate with auxiliary contact pads and probe card therewith 失效
    带有辅助接触垫和探头卡的探头基板

    公开(公告)号：US08198908B2

    公开(公告)日：2012-06-12

    申请号：US12461125

    申请日：2009-07-31

    申请人： Won Hee Yoo ,  Byeung Gyu Chang

    发明人： Won Hee Yoo ,  Byeung Gyu Chang

    IPC分类号： G01R31/00

    CPC分类号： G01R31/2889 ,  G01R1/07378

    摘要： Disclosed are a probe substrate and a probe card using the same. The probe substrate includes a ceramic stack structure stacked with a plurality of layers; vias disposed in the ceramic stack structure to perform inner-layer connection, and pads electrically connected to the vias; a contact opening disposed at the ceramic stack structure, and partially exposing the pads; and contact pads disposed at side walls of the contact opening, electrically connected to the pads, and electrically connected to pogo pins.

    摘要翻译： 公开了一种探针基板和使用其的探针卡。 探针基板包括堆叠有多个层的陶瓷堆叠结构; 设置在陶瓷堆叠结构中以进行内层连接的通孔和电连接到通孔的焊盘; 设置在所述陶瓷堆叠结构处的接触开口，并且部分地露出所述垫; 以及设置在接触开口的侧壁处的电连接到焊盘并且电连接到弹簧销的接触垫。

    Method for forming electrode pattern of ceramic substrate
    8.
    发明授权
    Method for forming electrode pattern of ceramic substrate 有权
    形成陶瓷基板电极图案的方法

    公开(公告)号：US08198198B2

    公开(公告)日：2012-06-12

    申请号：US12458834

    申请日：2009-07-23

    申请人： Won Hee Yoo ,  Byeung Gyu Chang ,  Yong Suk Kim

    发明人： Won Hee Yoo ,  Byeung Gyu Chang ,  Yong Suk Kim

    IPC分类号： H01L21/302

    CPC分类号： G01R3/00 ,  G01R1/06761 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/143 ,  H05K3/388

    摘要： The present invention relates to a method for forming electrode patterns of a ceramic substrate including the steps of: forming a plurality of conductive adhesion patterns on the ceramic substrate to be separated apart from one another; forming a plating seed layer, covering the conductive adhesion patterns, on the ceramic substrate; forming photoresist patterns, exposing parts corresponding to the conductive adhesion patterns, on the plating seed layer; forming a plating layer on the plating seed layer exposed by the photoresist patterns; removing the photoresist patterns; and etching parts of the plating seed layer exposed by removal of the photoresist patterns.

    摘要翻译： 本发明涉及一种形成陶瓷基板的电极图案的方法，包括以下步骤：在陶瓷基板上形成多个导电粘合图案以彼此分开; 在陶瓷基板上形成覆盖导电粘合图案的电镀种子层; 在电镀种子层上形成光致抗蚀剂图案，暴露与导电粘合图案相对应的部分; 在由光致抗蚀剂图案曝光的电镀种子层上形成镀层; 去除光致抗蚀剂图案; 以及通过去除光致抗蚀剂图案来蚀刻暴露的电镀种子层的部分。

    Probe substrate and probe card having the same
    9.
    发明申请
    Probe substrate and probe card having the same 失效
    具有相同的探头基板和探针卡

    公开(公告)号：US20100283495A1

    公开(公告)日：2010-11-11

    申请号：US12461125

    申请日：2009-07-31

    申请人： Won Hee Yoo ,  Byeung Gyu Chang

    发明人： Won Hee Yoo ,  Byeung Gyu Chang

    IPC分类号： G01R1/06 ,  G01R31/02

    CPC分类号： G01R31/2889 ,  G01R1/07378

    摘要： Disclosed are a probe substrate and a probe card using the same. The probe substrate includes a ceramic stack structure stacked with a plurality of layers; vias disposed in the ceramic stack structure to perform inner-layer connection, and pads electrically connected to the vias; a contact opening disposed at the ceramic stack structure, and partially exposing the pads; and contact pads disposed at side walls of the contact opening, electrically connected to the pads, and electrically connected to pogo pins.

    摘要翻译： 公开了一种探针基板和使用其的探针卡。 探针基板包括堆叠有多个层的陶瓷堆叠结构; 设置在陶瓷堆叠结构中以进行内层连接的通孔和电连接到通孔的焊盘; 设置在所述陶瓷堆叠结构处的接触开口，并且部分地露出所述垫; 以及设置在接触开口的侧壁处的电连接到焊盘并且电连接到弹簧销的接触垫。

    Method for forming electrode pattern of ceramic substrate
    10.
    发明申请
    Method for forming electrode pattern of ceramic substrate 有权
    形成陶瓷基板电极图案的方法

    公开(公告)号：US20100301009A1

    公开(公告)日：2010-12-02

    申请号：US12458834

    申请日：2009-07-23

    申请人： Won Hee Yoo ,  Byeung Gyu Chang ,  Yong Suk Kim

    发明人： Won Hee Yoo ,  Byeung Gyu Chang ,  Yong Suk Kim

    IPC分类号： C23F1/00

    CPC分类号： G01R3/00 ,  G01R1/06761 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/143 ,  H05K3/388

    摘要： The present invention relates to a method for forming electrode patterns of a ceramic substrate including the steps of: forming a plurality of conductive adhesion patterns on the ceramic substrate to be separated apart from one another; forming a plating seed layer, covering the conductive adhesion patterns, on the ceramic substrate; forming photoresist patterns, exposing parts corresponding to the conductive adhesion patterns, on the plating seed layer; forming a plating layer on the plating seed layer exposed by the photoresist patterns; removing the photoresist patterns; and etching parts of the plating seed layer exposed by removal of the photoresist patterns.

    摘要翻译： 本发明涉及一种形成陶瓷基板的电极图案的方法，包括以下步骤：在陶瓷基板上形成多个导电粘合图案以彼此分开; 在陶瓷基板上形成覆盖导电粘合图案的电镀种子层; 在电镀种子层上形成光致抗蚀剂图案，暴露与导电粘合图案相对应的部分; 在由光致抗蚀剂图案曝光的电镀种子层上形成镀层; 去除光致抗蚀剂图案; 以及通过去除光致抗蚀剂图案来蚀刻暴露的电镀种子层的部分。