Invention Application
- Patent Title: WAFER HOLDER AND TEMPERATURE CONDITIONING ARRANGEMENT AND METHOD OF MANUFACTURING A WAFER
- Patent Title (中): 散热器和温度调节装置及其制造方法
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Application No.: US13220903Application Date: 2011-08-30
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Publication No.: US20130052834A1Publication Date: 2013-02-28
- Inventor: Juergen Kielwein , Bart Scholte Von Mast , Rogier Lodder
- Applicant: Juergen Kielwein , Bart Scholte Von Mast , Rogier Lodder
- Applicant Address: LI Balzers
- Assignee: OC Oerlikon Balzers AG
- Current Assignee: OC Oerlikon Balzers AG
- Current Assignee Address: LI Balzers
- Main IPC: H01L21/31
- IPC: H01L21/31 ; F27D11/12
Abstract:
A wafer holder and temperature controlling arrangement has a metal circular wafer carrier plate, which covers a heater compartment. In the heater compartment a multitude of heater lamp tubes is arranged, which directly acts upon the circular wafer carrier plate. Latter is drivingly rotatable about the central axis. A wafer is held on the circular wafer carrier plate by means of a weight-ring residing upon the periphery of a wafer deposited on the wafer carrier plate.
Public/Granted literature
- US09793144B2 Wafer holder and temperature conditioning arrangement and method of manufacturing a wafer Public/Granted day:2017-10-17
Information query
IPC分类:
