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1.发明授权公开(公告)号：US09793144B2
公开(公告)日：2017-10-17
申请号：US13220903
申请日：2011-08-30
CPC分类号： H01L21/67115
摘要： A wafer holder and temperature controlling arrangement has a metal circular wafer carrier plate, which covers a heater compartment. In the heater compartment a multitude of heater lamp tubes is arranged, which directly acts upon the circular wafer carrier plate. Latter is drivingly rotatable about the central axis. A wafer is held on the circular wafer carrier plate by means of a weight-ring residing upon the periphery of a wafer deposited on the wafer carrier plate.
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2.发明申请公开(公告)号：US20130052834A1
公开(公告)日：2013-02-28
申请号：US13220903
申请日：2011-08-30
CPC分类号： H01L21/67115
摘要： A wafer holder and temperature controlling arrangement has a metal circular wafer carrier plate, which covers a heater compartment. In the heater compartment a multitude of heater lamp tubes is arranged, which directly acts upon the circular wafer carrier plate. Latter is drivingly rotatable about the central axis. A wafer is held on the circular wafer carrier plate by means of a weight-ring residing upon the periphery of a wafer deposited on the wafer carrier plate.
摘要翻译： 晶片保持器和温度控制装置具有覆盖加热器隔室的金属圆形晶片承载板。 在加热器隔室中设置有多个加热器灯管，其直接作用在圆形晶片载体板上。 后者可绕中心轴线旋转。 通过位于晶片承载板上淀积的晶片周围的重量环将晶片保持在圆形晶片承载板上。
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公开(公告)号：US09396981B2
公开(公告)日：2016-07-19
申请号：US13976314
申请日：2011-12-27
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： C23C16/458 , C23C14/50 , C23C14/541 , C23C16/4412 , C23C16/52 , F04B45/02 , H01J37/32724 , H01J37/32834 , H01J2237/3321 , H01L21/6719 , H01L21/67703 , H01L21/67739 , H01L21/67748 , H01L21/67751 , H01L21/6776
摘要： To reduce pumping time of a vacuum treatment chamber served by a transport arrangement in a transport chamber the vacuum treatment chamber is split into a workpiece treatment compartment and a pumping compartment in mutual free flow communication and arranged opposite each other with respect to a movement path of the transport arrangement serving the vacuum treatment chamber. The pumping compartment allows a pumping port to have a flow cross-section area that is freely selectable independently from the geometry of the treatment compartment.
摘要翻译： 为了减少由传送装置在传送室中所服务的真空处理室的抽吸时间，真空处理室被分成相互自由流动连通的工件处理室和泵室，并相对于运动路径 用于真空处理室的运输装置。 泵送室允许泵送端口具有可独立于治疗隔室的几何形状自由选择的流动横截面区域。
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公开(公告)号：US20140086711A1
公开(公告)日：2014-03-27
申请号：US13976314
申请日：2011-12-27
IPC分类号： H01L21/677
CPC分类号： C23C16/458 , C23C14/50 , C23C14/541 , C23C16/4412 , C23C16/52 , F04B45/02 , H01J37/32724 , H01J37/32834 , H01J2237/3321 , H01L21/6719 , H01L21/67703 , H01L21/67739 , H01L21/67748 , H01L21/67751 , H01L21/6776
摘要： To reduce pumping time of a vacuum treatment chamber served by a transport arrangement in a transport chamber the vacuum treatment chamber is split into a workpiece treatment compartment and a pumping compartment in mutual free flow communication and arranged opposite each other with respect to a movement path of the transport arrangement serving the vacuum treatment chamber. The pumping compartment allows a pumping port to have a flow cross-section area that is freely selectable independently from the geometry of the treatment compartment.
摘要翻译： 为了减少由传送装置在传送室中所服务的真空处理室的抽吸时间，真空处理室被分成相互自由流动连通的工件处理室和泵室，并相对于运动路径 用于真空处理室的运输装置。 泵送室允许泵送端口具有可独立于治疗隔室的几何形状自由选择的流动横截面区域。
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公开(公告)号：US09252037B2
公开(公告)日：2016-02-02
申请号：US13997801
申请日：2011-12-27
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： C23C16/458 , C23C14/50 , C23C14/541 , C23C16/4412 , C23C16/52 , F04B45/02 , H01J37/32724 , H01J37/32834 , H01J2237/3321 , H01L21/6719 , H01L21/67703 , H01L21/67739 , H01L21/67748 , H01L21/67751 , H01L21/6776
摘要： A vacuum treatment apparatus and method for manufacturing has a plurality of treatment chambers for treating workpieces, in particular silicon wafers, a transfer chamber attached to the treatment chambers communicating via respective openings and having handling zones located adjacent to each of the treatment chambers. A workpiece carrier is arranged within the transfer chamber and configured to transfer the workpieces between the handling zones, and one or more handlers for moving the workpieces between the handling zones and the treatment chambers. The transfer chamber is ring-shaped about an axis and the openings have opening substantially parallel thereto. This way, forces on the transfer chamber are redirected to a large support structure and thus, a cost-effective, light and still rigid mechanical construction can be achieved.
摘要翻译： 真空处理装置和制造方法具有多个用于处理工件，特别是硅晶片的处理室，附接到经由各个开口连通的处理室的传送室，并且具有位于每个处理室附近的处理区域。 工件载体布置在传送室内并且构造成在处理区域之间传送工件，以及用于在处理区域和处理室之间移动工件的一个或多个处理器。 传送室围绕轴线是环形的并且开口具有基本上与其平行的开口。 这样，转移室上的力被重定向到大的支撑结构，因此，可以实现成本有效，轻且刚性的机械结构。
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公开(公告)号：US20130287527A1
公开(公告)日：2013-10-31
申请号：US13997801
申请日：2011-12-27
IPC分类号： H01L21/677
CPC分类号： C23C16/458 , C23C14/50 , C23C14/541 , C23C16/4412 , C23C16/52 , F04B45/02 , H01J37/32724 , H01J37/32834 , H01J2237/3321 , H01L21/6719 , H01L21/67703 , H01L21/67739 , H01L21/67748 , H01L21/67751 , H01L21/6776
摘要： A vacuum treatment apparatus and method for manufacturing has a plurality of treatment chambers for treating workpieces, in particular silicon wafers, a transfer chamber attached to the treatment chambers communicating via respective openings and having handling zones located adjacent to each of the treatment chambers. A workpiece carrier is arranged within the transfer chamber and configured to transfer the workpieces between the handling zones, and one or more handlers for moving the workpieces between the handling zones and the treatment chambers. The transfer chamber is ring-shaped about an axis and the openings have opening substantially parallel thereto. This way, forces on the transfer chamber are redirected to a large support structure and thus, a cost-effective, light and still rigid mechanical construction can be achieved.
摘要翻译： 真空处理装置和制造方法具有多个用于处理工件，特别是硅晶片的处理室，附接到经由各个开口连通的处理室的传送室，并且具有位于每个处理室附近的处理区域。 工件载体布置在传送室内并且构造成在处理区域之间传送工件，以及用于在处理区域和处理室之间移动工件的一个或多个处理器。 传送室围绕轴线是环形的并且开口具有基本上与其平行的开口。 这样，转移室上的力被重定向到大的支撑结构，因此，可以实现成本有效，轻且刚性的机械结构。
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