WAFER HOLDER AND TEMPERATURE CONDITIONING ARRANGEMENT AND METHOD OF MANUFACTURING A WAFER
    2.
    发明申请
    WAFER HOLDER AND TEMPERATURE CONDITIONING ARRANGEMENT AND METHOD OF MANUFACTURING A WAFER 有权
    散热器和温度调节装置及其制造方法

    公开(公告)号:US20130052834A1

    公开(公告)日:2013-02-28

    申请号:US13220903

    申请日:2011-08-30

    IPC分类号: H01L21/31 F27D11/12

    CPC分类号: H01L21/67115

    摘要: A wafer holder and temperature controlling arrangement has a metal circular wafer carrier plate, which covers a heater compartment. In the heater compartment a multitude of heater lamp tubes is arranged, which directly acts upon the circular wafer carrier plate. Latter is drivingly rotatable about the central axis. A wafer is held on the circular wafer carrier plate by means of a weight-ring residing upon the periphery of a wafer deposited on the wafer carrier plate.

    摘要翻译: 晶片保持器和温度控制装置具有覆盖加热器隔室的金属圆形晶片承载板。 在加热器隔室中设置有多个加热器灯管,其直接作用在圆形晶片载体板上。 后者可绕中心轴线旋转。 通过位于晶片承载板上淀积的晶片周围的重量环将晶片保持在圆形晶片承载板上。