发明申请
- 专利标题： Method of Three Dimensional Integrated Circuit Assembly
- 专利标题（中）： 三维集成电路组装方法
-
申请号： US13224575申请日： 2011-09-02
-
公开(公告)号： US20130056865A1公开(公告)日： 2013-03-07
- 发明人: Jing-Cheng Lin , Weng-Jin Wu , Shih Ting Lin , Cheng-Lin Huang , Szu Wei Lu , Shin-Puu Jeng , Chen-Hua Yu
- 申请人： Jing-Cheng Lin , Weng-Jin Wu , Shih Ting Lin , Cheng-Lin Huang , Szu Wei Lu , Shin-Puu Jeng , Chen-Hua Yu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; H01L23/498
摘要：
A method of fabricating a three-dimensional integrated circuit comprises attaching a wafer to a carrier, mounting a plurality of semiconductor dies on top of the wafer to form a wafer stack. The method further comprises forming a molding compound layer on top of the wafer, attaching the wafer stack to a tape frame and dicing the wafer stack to separate the wafer stack into a plurality of individual packages.
公开/授权文献
- US09418876B2 Method of three dimensional integrated circuit assembly 公开/授权日：2016-08-16
信息查询
IPC分类:
