公开(公告)号：US09418876B2

公开(公告)日：2016-08-16

申请号：US13224575

申请日：2011-09-02

申请人： Jing-Cheng Lin ,  Weng-Jin Wu ,  Shih Ting Lin ,  Cheng-Lin Huang ,  Szu Wei Lu ,  Shin-Puu Jeng ,  Chen-Hua Yu

发明人： Jing-Cheng Lin ,  Weng-Jin Wu ,  Shih Ting Lin ,  Cheng-Lin Huang ,  Szu Wei Lu ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L21/683 ,  H01L25/065 ,  H01L23/00

CPC分类号： H01L21/78 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/16 ,  H01L25/0652 ,  H01L2221/68327 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2224/81

摘要： A method of fabricating a three-dimensional integrated circuit comprises attaching a wafer to a carrier, mounting a plurality of semiconductor dies on top of the wafer to form a wafer stack. The method further comprises forming a molding compound layer on top of the wafer, attaching the wafer stack to a tape frame and dicing the wafer stack to separate the wafer stack into a plurality of individual packages.

摘要翻译： 制造三维集成电路的方法包括将晶片附着到载体上，将多个半导体管芯安装在晶片的顶部上以形成晶片堆叠。 该方法还包括在晶片的顶部上形成模塑复合层，将晶片堆叠连接到胶带框架上，并切割晶片堆叠以将晶片堆叠分离成多个单独的封装。

公开(公告)号：US20130056865A1

公开(公告)日：2013-03-07

申请号：US13224575

申请日：2011-09-02

申请人： Jing-Cheng Lin ,  Weng-Jin Wu ,  Shih Ting Lin ,  Cheng-Lin Huang ,  Szu Wei Lu ,  Shin-Puu Jeng ,  Chen-Hua Yu

发明人： Jing-Cheng Lin ,  Weng-Jin Wu ,  Shih Ting Lin ,  Cheng-Lin Huang ,  Szu Wei Lu ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC分类号： H01L21/78 ,  H01L23/498

CPC分类号： H01L21/78 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/16 ,  H01L25/0652 ,  H01L2221/68327 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2224/81

摘要： A method of fabricating a three-dimensional integrated circuit comprises attaching a wafer to a carrier, mounting a plurality of semiconductor dies on top of the wafer to form a wafer stack. The method further comprises forming a molding compound layer on top of the wafer, attaching the wafer stack to a tape frame and dicing the wafer stack to separate the wafer stack into a plurality of individual packages.

摘要翻译： 制造三维集成电路的方法包括将晶片附着到载体上，将多个半导体管芯安装在晶片的顶部上以形成晶片堆叠。 该方法还包括在晶片的顶部上形成模塑复合层，将晶片堆叠连接到胶带框架上，并切割晶片堆叠以将晶片堆叠分离成多个单独的封装。

公开(公告)号：US20130134559A1

公开(公告)日：2013-05-30

申请号：US13397204

申请日：2012-02-15

申请人： Jing-Cheng Lin ,  Hsin Chang ,  Shih Ting Lin

发明人： Jing-Cheng Lin ,  Hsin Chang ,  Shih Ting Lin

IPC分类号： H01L23/48 ,  H01L21/78 ,  H01L23/544

CPC分类号： H01L23/28 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/06 ,  H01L24/14 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00014

摘要： A package component includes a substrate, wherein the substrate has a front surface and a back surface over the front surface. A through-via penetrates through the substrate. A conductive feature is disposed over the back surface of the substrate and electrically coupled to the through-via. A first dielectric pattern forms a ring covering edge portions of the conductive feature. An Under-Bump-Metallurgy (UBM) is disposed over and in contact with a center portion of the conductive feature. A polymer contacts a sidewall of the substrate. A second dielectric pattern is disposed over and aligned to the polymer. The first and the second dielectric patterns are formed of a same dielectric material, and are disposed at substantially a same level.

公开(公告)号：US08643148B2

公开(公告)日：2014-02-04

申请号：US13397204

申请日：2012-02-15

申请人： Jing-Cheng Lin ,  Hsin Chang ,  Shih Ting Lin

发明人： Jing-Cheng Lin ,  Hsin Chang ,  Shih Ting Lin

IPC分类号： H01L21/78

CPC分类号： H01L23/28 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/06 ,  H01L24/14 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00014

摘要： A package component includes a substrate, wherein the substrate has a front surface and a back surface over the front surface. A through-via penetrates through the substrate. A conductive feature is disposed over the back surface of the substrate and electrically coupled to the through-via. A first dielectric pattern forms a ring covering edge portions of the conductive feature. An Under-Bump-Metallurgy (UBM) is disposed over and in contact with a center portion of the conductive feature. A polymer contacts a sidewall of the substrate. A second dielectric pattern is disposed over and aligned to the polymer. The first and the second dielectric patterns are formed of a same dielectric material, and are disposed at substantially a same level.

摘要翻译： 包装部件包括基板，其中基板具有前表面和在前表面上的后表面。 通孔穿过基底。 导电特征设置在衬底的背表面上并电连接到通孔。 第一电介质图案形成导电特征的环覆盖边缘部分。 底部金属（UBM）被布置在导电特征的中心部分上并与其接触。 聚合物接触衬底的侧壁。 将第二电介质图案设置在聚合物上并对准聚合物。 第一和第二电介质图案由相同的电介质材料形成，并且设置在基本上相同的水平。

公开(公告)号：US08774239B2

公开(公告)日：2014-07-08

申请号：US13372841

申请日：2012-02-14

申请人： Yao Wun Jhang ,  Hsin Chia Su ,  Chien Ming Huang ,  Chieh Hu ,  Hong Xi Tsau ,  Shih Ting Lin

发明人： Yao Wun Jhang ,  Hsin Chia Su ,  Chien Ming Huang ,  Chieh Hu ,  Hong Xi Tsau ,  Shih Ting Lin

IPC分类号： H01S3/10 ,  H04B10/17

CPC分类号： H01S3/06754 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0064 ,  H01S3/094003 ,  H01S3/1618

摘要： An ultrafast laser generating system comprises a laser signal generator, a laser signal amplifier and a beam splitting element. The laser signal generator is configured to generate a first nanosecond pulse laser. The laser amplifier is configured to amplify the first nanosecond pulse laser from the laser signal generator so as to generate a second nanosecond pulse laser, which includes a picosecond pulse laser. The beam splitting element is configured to receive the second nanosecond pulse laser and split the picosecond pulse laser from the second nanosecond pulse laser.

摘要翻译： 超快激光发生系统包括激光信号发生器，激光信号放大器和分束元件。 激光信号发生器被配置为产生第一纳秒脉冲激光器。 激光放大器被配置为放大来自激光信号发生器的第一纳秒脉冲激光器，以便产生包括皮秒脉冲激光器的第二纳秒脉冲激光器。 分束元件被配置为接收第二纳秒脉冲激光器并从第二纳秒脉冲激光器分离皮秒脉冲激光器。

公开(公告)号：US08855152B2

公开(公告)日：2014-10-07

申请号：US13303553

申请日：2011-11-23

申请人： Yao Wun Jhang ,  Chien Ming Huang ,  Hsin Chia Su ,  Shih Ting Lin ,  Hong Xi Tsau

发明人： Yao Wun Jhang ,  Chien Ming Huang ,  Hsin Chia Su ,  Shih Ting Lin ,  Hong Xi Tsau

IPC分类号： H01S3/10 ,  G02F1/01 ,  G02F1/35 ,  G02F1/365 ,  H01S3/067

CPC分类号： G02F1/0136 ,  G02F1/3511 ,  G02F1/365 ,  G02F2001/3528 ,  G02F2201/02 ,  G02F2202/32 ,  H01S3/06712 ,  H01S3/06754 ,  H01S3/10061

摘要： A polarization modulation device for wideband laser comprises a first polarization maintaining optical fiber, a second polarization maintaining optical fiber, and a non-polarization maintaining optical fiber. The non-polarization maintaining optical fiber includes a first polarization controller coupled with the first polarization maintaining optical fiber, and a second polarization controller coupled with the second polarization maintaining optical fiber.

摘要翻译： 用于宽带激光器的偏振调制装置包括第一偏振保持光纤，第二偏振维持光纤和非偏振保持光纤。 非偏振维持光纤包括与第一偏振保持光纤耦合的第一偏振控制器和与第二偏振保持光纤耦合的第二偏振控制器。

公开(公告)号：US08695426B2

公开(公告)日：2014-04-15

申请号：US13220068

申请日：2011-08-29

申请人： Yu Wen Hsu ,  Shih Ting Lin ,  Jen Yi Chen ,  Chao Ta Huang

发明人： Yu Wen Hsu ,  Shih Ting Lin ,  Jen Yi Chen ,  Chao Ta Huang

IPC分类号： G01C19/56

CPC分类号： B81C1/00301 ,  B81B3/0086 ,  B81B2201/0242 ,  B81B2207/07 ,  B81C2203/0792 ,  G01C19/5762

摘要： The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.

摘要翻译： 本公开涉及具有电绝缘结构的微机电系统（MEMS）装置。 MEMS器件包括至少一个移动部件，至少一个锚固件，至少一个弹簧和绝缘层。 弹簧连接到锚固件和移动部件。 绝缘层设置在移动部分和锚中。 移动部分和锚固体中的每一个被绝缘层分成两个导电部分。 由此，不同运动部件的电信号通过未电气连接的绝缘电路传输。

公开(公告)号：US20120160027A1

公开(公告)日：2012-06-28

申请号：US13220068

申请日：2011-08-29

申请人： Yu Wen HSU ,  Shih Ting Lin ,  Jen Yi Chen ,  Chao Ta Huang

发明人： Yu Wen HSU ,  Shih Ting Lin ,  Jen Yi Chen ,  Chao Ta Huang

IPC分类号： G01C19/02 ,  H01L21/02

CPC分类号： B81C1/00301 ,  B81B3/0086 ,  B81B2201/0242 ,  B81B2207/07 ,  B81C2203/0792 ,  G01C19/5762

摘要： The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.

摘要翻译： 本公开涉及具有电绝缘结构的微机电系统（MEMS）装置。 MEMS器件包括至少一个移动部件，至少一个锚固件，至少一个弹簧和绝缘层。 弹簧连接到锚固件和移动部件。 绝缘层设置在移动部分和锚中。 移动部分和锚固体中的每一个被绝缘层分成两个导电部分。 由此，不同运动部件的电信号通过未电气连接的绝缘电路传输。

公开(公告)号：US09227841B2

公开(公告)日：2016-01-05

申请号：US14274118

申请日：2014-05-09

申请人： Chao Ta Huang ,  Shih Ting Lin ,  Yu Wen Hsu

发明人： Chao Ta Huang ,  Shih Ting Lin ,  Yu Wen Hsu

IPC分类号： H01L41/08 ,  B81C1/00 ,  B81B7/00 ,  H01L41/113 ,  H01L41/09

CPC分类号： B81C1/00134 ,  B81B7/0064 ,  B81C1/0023 ,  B81C2203/00 ,  B81C2203/0792 ,  H01L41/0933 ,  H01L41/1134 ,  H01L2224/11

摘要： One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.

摘要翻译： 一个实施例公开了一种将微机电系统装置与包括电路芯片，微机电系统装置，密封环和盖的电路芯片集成的装置。 电路芯片包括基板和多个金属接合区域。 基板具有具有电路面积的有源表面，并且金属接合区域设置在有源表面上并电连接到电路。 微机电系统装置包括多个基座和至少一个感测元件。 基底连接至至少一个金属接合区域。 至少一个感测元件弹性地连接到基座。 所述密封环围绕所述基部，并且与所述金属接合区域中的至少一个连接。 盖与电路芯片的有效表面相对，并连接到密封环，以具有密封感测元件和电路芯片的有效表面的密封室。

公开(公告)号：US20120001276A1

公开(公告)日：2012-01-05

申请号：US13173119

申请日：2011-06-30

申请人： Chao Ta HUANG ,  Shih Ting Lin ,  Yu Wen Hsu

发明人： Chao Ta HUANG ,  Shih Ting Lin ,  Yu Wen Hsu

IPC分类号： H01L29/84 ,  H01L21/02

CPC分类号： B81C1/00134 ,  B81B7/0064 ,  B81C1/0023 ,  B81C2203/00 ,  B81C2203/0792 ,  H01L41/0933 ,  H01L41/1134 ,  H01L2224/11

摘要： One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which comprises a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.

摘要翻译： 一个实施例公开了一种将微机电系统装置与包括电路芯片，微机电系统装置，密封环和盖子的电路芯片集成的装置。 电路芯片包括基板和多个金属接合区域。 基板具有具有电路面积的有源表面，并且金属接合区域设置在有源表面上并电连接到电路。 微机电系统装置包括多个基座和至少一个感测元件。 基底连接至至少一个金属接合区域。 至少一个感测元件弹性地连接到基座。 所述密封环围绕所述基部，并且与所述金属接合区域中的至少一个连接。 盖与电路芯片的有效表面相对，并连接到密封环，以具有密封感测元件和电路芯片的有效表面的密封室。