发明申请
- 专利标题: Inductors and Methods for Integrated Circuits
- 专利标题(中): 集成电路的电感和方法
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申请号: US13677061申请日: 2012-11-14
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公开(公告)号: US20130071983A1公开(公告)日: 2013-03-21
- 发明人: Joseph P. Ellul , Khanh Tran , Edward Martin Godshalk , Albert Bergemont
- 申请人: Joseph P. Ellul , Khanh Tran , Edward Martin Godshalk , Albert Bergemont
- 主分类号: H01L49/02
- IPC分类号: H01L49/02
摘要:
Inductors and methods for integrated circuits that result in inductors of a size compatible with integrated circuits, allowing the fabrication of inductors, with or without additional circuitry on a first wafer and the bonding of that wafer to a second wafer without wasting of wafer area. The inductors in the first wafer are comprised of coils formed by conductors at each surface of the first wafer coupled to conductors in holes passing through the first wafer. Various embodiments are disclosed.
公开/授权文献
- US08847365B2 Inductors and methods for integrated circuits 公开/授权日:2014-09-30