发明申请
- 专利标题: THREE PORT MTJ STRUCTURE AND INTEGRATION
- 专利标题(中): 三港MTJ结构与整合
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申请号: US13356720申请日: 2012-01-24
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公开(公告)号: US20130114336A1公开(公告)日: 2013-05-09
- 发明人: Xia Li , Xiaochun Zhu , Seung H. Kang , Jung Pill Kim , Wah Nam Hsu , Taehyun Kim , Kangho Lee
- 申请人: Xia Li , Xiaochun Zhu , Seung H. Kang , Jung Pill Kim , Wah Nam Hsu , Taehyun Kim , Kangho Lee
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM Incorporated
- 当前专利权人: QUALCOMM Incorporated
- 当前专利权人地址: US CA San Diego
- 主分类号: G11C11/14
- IPC分类号: G11C11/14 ; H01L21/8246 ; H01L29/82
摘要:
A two-transistor one-MTJ (2T1MTJ) three port structure includes two separate pin layer structures coupled to one free layer structure. The pin layer structures may include an anti-ferromagnetic layer (AFM) layer coupled to a pin layer. The free layer structure includes free layer coupled to a barrier layer and a cap layer. The free layer structure may include a thin barrier layer coupled to each of the pin layer stacks. The three port MTJ structure provides separate write and read paths which improve read sensing margin without increasing write voltage or current. The three port MTJ structure may be fabricated with a simple two step MTJ etch process.
公开/授权文献
- US09064589B2 Three port MTJ structure and integration 公开/授权日:2015-06-23
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