发明申请
- 专利标题： HIGH DENSITY TERMINAL CONTACTS FOR STIMULATION LEAD AND STIMULATION SYSTEM EMPLOYING THE SAME, AND METHOD OF STIMULATION LEAD FABRICATION
- 专利标题（中）： 用于刺激引导和刺激系统的高密度终端接触及其刺激方法
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申请号： US13607280申请日： 2012-09-07
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公开(公告)号： US20130123891A1公开(公告)日： 2013-05-16
- 发明人: John Swanson
- 申请人： John Swanson
- 主分类号： A61N1/04
- IPC分类号： A61N1/04 ; H05K3/12 ; H05K3/02 ; H05K3/00 ; H05K3/06
摘要：
In one embodiment, a method of fabricating a lead comprises: providing a lead body comprising a plurality of conductive wires; providing a flex film connector structure, the flex film connector structure comprising a plurality of conductive pads on a first portion of the flex film connector structure, a plurality of contacts on a second portion of the flex film connectors, and a plurality of traces electrically connecting the plurality of conductive pads with the plurality of contacts; placing the first portion of the flex film connector adjacent to a cross-section of one end of the lead body; electrically coupling the plurality of conductive pads of the flex film connector structure to the plurality of conductive wires at the one end of the lead body; and wrapping the second portion of the flex film connector structure about the lead body to form a plurality of electrical contacts.
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