Disclosed herein is a printed circuit board including: a substrate; first upper and lower insulating layers covering upper and lower sides of the substrate; a via penetrating the substrate and the first upper and lower insulating layers to form an electrical connection; and second upper and lower insulating layers covering or surrounding the via, wherein the first upper and lower insulating layers or the second upper and lower insulating layers include a general circuit region including general circuit patterns and circuit patterns connected to the via and a microcircuit region including microcircuit patterns having a smaller circuit line width than that of the general circuit region.