公开(公告)号：US20130153280A1

公开(公告)日：2013-06-20

申请号：US13425622

申请日：2012-03-21

申请人： Sang Hoon Kim ,  Going Sik Kim

发明人： Sang Hoon Kim ,  Going Sik Kim

IPC分类号： H05K1/11 ,  H05K3/02 ,  H05K3/40 ,  H05K3/10

CPC分类号： H05K3/107 ,  H05K3/4647 ,  H05K3/4661 ,  H05K2201/0391 ,  H05K2201/09036 ,  Y10T29/49155 ,  Y10T29/49156

摘要： Disclosed herein is a printed circuit board including: a substrate; first upper and lower insulating layers covering upper and lower sides of the substrate; a via penetrating the substrate and the first upper and lower insulating layers to form an electrical connection; and second upper and lower insulating layers covering or surrounding the via, wherein the first upper and lower insulating layers or the second upper and lower insulating layers include a general circuit region including general circuit patterns and circuit patterns connected to the via and a microcircuit region including microcircuit patterns having a smaller circuit line width than that of the general circuit region.

摘要翻译： 本文公开了一种印刷电路板，包括：基板; 第一上下绝缘层覆盖基板的上侧和下侧; 穿过基板和第一上绝缘层和下绝缘层的通孔以形成电连接; 以及覆盖或围绕通孔的第二上绝缘层和下绝缘层，其中第一上绝缘层或下绝缘层或第二上绝缘层和下绝缘层包括通用电路区域，其包括通常的电路图案和连接到通孔的电路图案，以及微电路区域， 电路线宽比通常的电路区域小的微电路图形。

公开(公告)号：US08981549B2

公开(公告)日：2015-03-17

申请号：US13340436

申请日：2011-12-29

申请人： Hye Jin Kim ,  Going Sik Kim ,  Chang Sup Ryu

发明人： Hye Jin Kim ,  Going Sik Kim ,  Chang Sup Ryu

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L23/13 ,  H01L23/31

CPC分类号： H01L24/48 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/45 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2225/0651 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The preferred embodiment of the present invention can prevent signal distortions such as stress, or the like, occurring at the time of power delivery due to the difference in the lengths of the metal wires for electrically connecting each of the plurality of semiconductor chips formed on the dual die package substrate.

摘要翻译： 本发明的优选实施例可以防止由于用于电连接形成在多个半导体芯片上的多个半导体芯片中的每一个的金属线的长度差而在发电时发生的诸如应力等的信号失真 双模封装基板。

公开(公告)号：US20100147563A1

公开(公告)日：2010-06-17

申请号：US12476802

申请日：2009-06-02

申请人： Young Po Park ,  Going Sik Kim ,  Hwan Yong Jung ,  Ha II Kim ,  Dong Gi An ,  Myeong Hui Jung

发明人： Young Po Park ,  Going Sik Kim ,  Hwan Yong Jung ,  Ha II Kim ,  Dong Gi An ,  Myeong Hui Jung

IPC分类号： H05K1/11

CPC分类号： H05K1/0218 ,  H05K3/28 ,  H05K3/4691 ,  H05K2201/0715 ,  H05K2201/09627

摘要： Disclosed is a substrate having an electromagnetic shielding member, which includes a first circuit layer connected to a ground layer, a coverlay formed on the first circuit layer, an electromagnetic shielding member formed on the coverlay, and a first via formed in the coverlay to connect the electromagnetic shielding member to the first circuit layer, so that the electromagnetic shielding member and the ground layer are connected to each other through a via structure, thereby preventing the electromagnetic shielding member from becoming cracked due to the stepped portion of the substrate.

摘要翻译： 公开了具有电磁屏蔽构件的基板，其包括连接到接地层的第一电路层，形成在第一电路层上的覆盖层，形成在覆盖层上的电磁屏蔽构件，以及形成在覆盖层中以连接的第一通孔 电磁屏蔽构件通过通孔结构彼此连接，从而防止电磁屏蔽构件由于基板的阶梯部而变得破裂。

公开(公告)号：US20100162562A1

公开(公告)日：2010-07-01

申请号：US12719618

申请日：2010-03-08

申请人： Yang Je LEE ,  Il Woon Shin ,  Going Sik Kim ,  Doo Pyo Hong ,  Ha Il Kim ,  Dong Gi An

发明人： Yang Je LEE ,  Il Woon Shin ,  Going Sik Kim ,  Doo Pyo Hong ,  Ha Il Kim ,  Dong Gi An

IPC分类号： H05K3/10

CPC分类号： H05K3/429 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4664 ,  H05K3/4691 ,  H05K2201/0195 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2203/054 ,  H05K2203/0554 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49171

摘要： A method of manufacturing a rigid-flexible printed circuit board, including providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate; forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region; forming outer circuit patterns including areas adjacent to the first windows; and applying solder resist in the rigid region to expose portions of the external circuit patterns, where the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays.

摘要翻译： 一种刚性柔性印刷电路板的制造方法，其特征在于，在分别形成有内部电路图案的两侧的柔性铜箔层压体的两面分别形成有覆盖层的基板， 在作为柔性铜箔层压体的刚性区域的覆盖层的部分上分层绝缘层和铜箔层; 在所述刚性区域中形成通孔，同时在所述覆盖层中形成柔性区域中的第一窗口; 形成包括与第一窗口相邻的区域的外部电路图案; 以及在所述刚性区域中施加阻焊剂以暴露所述外部电路图案的部分，其中形成在与所述第一窗口相邻的区域中的外部电路图案包括用于覆盖所述覆盖层的部分的附加电镀部分。

公开(公告)号：US08631567B2

公开(公告)日：2014-01-21

申请号：US12719618

申请日：2010-03-08

申请人： Yang Je Lee ,  Il Woon Shin ,  Going Sik Kim ,  Doo Pyo Hong ,  Ha Il Kim ,  Dong Gi An

发明人： Yang Je Lee ,  Il Woon Shin ,  Going Sik Kim ,  Doo Pyo Hong ,  Ha Il Kim ,  Dong Gi An

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K3/429 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4664 ,  H05K3/4691 ,  H05K2201/0195 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2203/054 ,  H05K2203/0554 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49171

摘要： A method of manufacturing a rigid-flexible printed circuit board, including providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate; forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region; forming outer circuit patterns including areas adjacent to the first windows; and applying solder resist in the rigid region to expose portions of the external circuit patterns, where the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays.

摘要翻译： 一种刚性柔性印刷电路板的制造方法，其特征在于，在分别形成有内部电路图案的两侧的柔性铜箔层压体的两面分别形成有覆盖层的基板， 在作为柔性铜箔层压体的刚性区域的覆盖层的部分上分层绝缘层和铜箔层; 在所述刚性区域中形成通孔，同时在所述覆盖层中形成柔性区域中的第一窗口; 形成包括与第一窗口相邻的区域的外部电路图案; 以及在所述刚性区域中施加阻焊剂以暴露所述外部电路图案的部分，其中形成在与所述第一窗口相邻的区域中的外部电路图案包括用于覆盖所述覆盖层的部分的附加电镀部分。

公开(公告)号：US20080014768A1

公开(公告)日：2008-01-17

申请号：US11708456

申请日：2007-02-21

申请人： Yang Je Lee ,  Il Woon Shin ,  Going Sik Kim ,  Doo Pyo Hong ,  Ha Il Kim ,  Dong Gi An

发明人： Yang Je Lee ,  Il Woon Shin ,  Going Sik Kim ,  Doo Pyo Hong ,  Ha Il Kim ,  Dong Gi An

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K3/429 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4664 ,  H05K3/4691 ,  H05K2201/0195 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2203/054 ,  H05K2203/0554 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49171

摘要： The present invention relates to a rigid-flexible printed circuit board and, more particularly, to a rigid-flexible printed circuit board including CL via holes which can facilitate electrical connection to an inner circuit pattern in a flexible region. Since the coverlays are layered on the entire surface of the double-sided FCCL without previous processing thereof, the via holes are formed in the coverlays while a drilling process is performed to form the via holes, and then the copper plating is performed over the entire surface thereof, it is possible to eliminate the cost of previously processing the coverlays, easily perform a process of provisionally layering the coverlays on the double-sided FCCL, and decrease the cost therefor.

摘要翻译： 本发明涉及刚性柔性印刷电路板，更具体地说，涉及一种刚性柔性印刷电路板，其包括CL通孔，其可以促进与柔性区域内部电路图形的电连接。 由于覆盖层在双面FCCL的整个表面上层叠而不进行前处理，所以在执行钻孔处理以形成通孔的同时，在覆盖层中形成通孔，然后在整个过程中执行镀铜 表面，可以消除预先处理覆盖层的成本，容易地执行在双面FCCL上临时层叠覆盖层的处理，并降低其成本。

公开(公告)号：US20080257742A1

公开(公告)日：2008-10-23

申请号：US12007243

申请日：2008-01-08

申请人： Yang Je Lee ,  Going Sik Kim ,  Dong Gi An ,  Mi Jung Han ,  Kyung Jin Heo ,  Young Kyu Lim

发明人： Yang Je Lee ,  Going Sik Kim ,  Dong Gi An ,  Mi Jung Han ,  Kyung Jin Heo ,  Young Kyu Lim

IPC分类号： C25D5/02

CPC分类号： H05K3/244 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K3/243 ,  H05K2201/0391 ,  H05K2203/072 ,  H05K2203/0723 ,  H01L2924/00

摘要： Disclosed is a method of manufacturing a printed circuit board for a semiconductor package, which minimizes or completely obviates masking work upon the plating of each pad for the surface treatment of a printed circuit board for a semiconductor package, thereby simplifying the overall process and increasing the mounting reliability.

摘要翻译： 公开了一种制造用于半导体封装的印刷电路板的方法，其最小化或完全避免了用于半导体封装的印刷电路板的表面处理的每个焊盘的电镀时的掩蔽工作，从而简化了整个工艺并增加了 安装可靠性。