Invention Application
US20130222510A1 RESISTANCE HEATING COMPOSITION, HEATING COMPOSITE USING THE COMPOSITION, METHOD OF PREPARING THE HEATING COMPOSITE, AND HEATING APPARATUS AND FUSING APPARATUS USING THE SAME
有权
电阻加热组合物，使用组合物的加热复合物，加热复合材料的制备方法，加热装置和使用该加热装置的加热装置
- Patent Title: RESISTANCE HEATING COMPOSITION, HEATING COMPOSITE USING THE COMPOSITION, METHOD OF PREPARING THE HEATING COMPOSITE, AND HEATING APPARATUS AND FUSING APPARATUS USING THE SAME
- Patent Title (中): 电阻加热组合物，使用组合物的加热复合物，加热复合材料的制备方法，加热装置和使用该加热装置的加热装置
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Application No.: US13565510Application Date: 2012-08-02
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Publication No.: US20130222510A1Publication Date: 2013-08-29
- Inventor: Dong-ouk KIM , Dong-earn KIM , Ha-Jin KIM , Sung-hoon PARK , Min-jong BAE , Yoon-chul SON , Sang-eui LEE , Kun-mo CHU , In-taek HAN
- Applicant: Dong-ouk KIM , Dong-earn KIM , Ha-Jin KIM , Sung-hoon PARK , Min-jong BAE , Yoon-chul SON , Sang-eui LEE , Kun-mo CHU , In-taek HAN
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2012-0019166 20120224
- Main IPC: H01B1/04
- IPC: H01B1/04 ; B41J2/435 ; H01B13/00 ; H05B3/20 ; B82Y30/00
Abstract:
A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.
Public/Granted literature
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