发明申请
US20130277213A1 SPUTTERING APPARATUS 审中-公开
溅射装置

  • 专利标题: SPUTTERING APPARATUS
  • 专利标题(中): 溅射装置
  • 申请号: US13922353
    申请日: 2013-06-20
  • 公开(公告)号: US20130277213A1
    公开(公告)日: 2013-10-24
  • 发明人: Yohsuke SHIBUYA
  • 申请人: CANON ANELVA CORPORATION
  • 优先权: JP2010-292111 20101228
  • 主分类号: C23C14/35
  • IPC分类号: C23C14/35
SPUTTERING APPARATUS
摘要:
The present invention provides a means capable of determining the surface state of the target to execute accurate and quick cleaning of necessary part. The means includes: a magnet unit capable of forming a magnetic field on the surface of a target; a rotary system capable of driving the magnet unit of change the magnetic field pattern; and an ammeter configured to measure target current when the magnetic field is formed by the magnet unit and discharge voltage is applied to a target electrode to which the target is attached. The position of the magnet unit is variously changed by the rotary system, and the target current is measured at each position and compared with a reference value. It is then determined whether cleaning is necessary at each position, so that cleaning can be performed only for necessary part.
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