SPUTTERING APPARATUS
    2.
    发明申请
    SPUTTERING APPARATUS 审中-公开
    溅射装置

    公开(公告)号:US20130277213A1

    公开(公告)日:2013-10-24

    申请号:US13922353

    申请日:2013-06-20

    Inventor: Yohsuke SHIBUYA

    Abstract: The present invention provides a means capable of determining the surface state of the target to execute accurate and quick cleaning of necessary part. The means includes: a magnet unit capable of forming a magnetic field on the surface of a target; a rotary system capable of driving the magnet unit of change the magnetic field pattern; and an ammeter configured to measure target current when the magnetic field is formed by the magnet unit and discharge voltage is applied to a target electrode to which the target is attached. The position of the magnet unit is variously changed by the rotary system, and the target current is measured at each position and compared with a reference value. It is then determined whether cleaning is necessary at each position, so that cleaning can be performed only for necessary part.

    Abstract translation: 本发明提供一种能够确定目标的表面状态以执行对必要部件的准确和快速清洁的装置。 该装置包括:能够在目标表面上形成磁场的磁体单元; 能够驱动所述磁体单元以改变所述磁场图案的旋转系统; 以及电流计,被配置为当由磁体单元形成磁场时测量目标电流,并且对目标附着的目标电极施加放电电压。 通过旋转系统不同地改变磁体单元的位置,并且在每个位置测量目标电流并与参考值进行比较。 然后确定是否需要在每个位置进行清洁,从而可以仅对必需的部分执行清洁。

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