发明申请
- 专利标题: SURFACE-TREATED COPPER FOIL
- 专利标题(中): 表面处理铜箔
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申请号: US13988450申请日: 2011-11-22
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公开(公告)号: US20130295407A1公开(公告)日: 2013-11-07
- 发明人: Shinichi Obata , Shinya Hiraoka , Fumiaki Hosokoshi , Ayumu Tateoka , Hideaki Matsushima , Koichi Miyake , Sakiko Tomonaga , Tomoyuki Maeda
- 申请人: Shinichi Obata , Shinya Hiraoka , Fumiaki Hosokoshi , Ayumu Tateoka , Hideaki Matsushima , Koichi Miyake , Sakiko Tomonaga , Tomoyuki Maeda
- 申请人地址: JP Tokyo
- 专利权人: MITSUI MINING & SMELTING CO., LTD.
- 当前专利权人: MITSUI MINING & SMELTING CO., LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2010-260369 20101122; JP2011-158177 20110719
- 国际申请: PCT/JP11/76959 WO 20111122
- 主分类号: H01B1/02
- IPC分类号: H01B1/02
摘要:
An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350° C. to 400° C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc alloy, and the either rust-proofing treatment layer is a zinc alloy layer having zinc amount of 20 mg/m2 to 1,000 mg/m2; and the copper foil contains one or two or more of small amount elements selected from carbon, sulfur, chlorine and nitrogen, and a sum amount thereof is 100 ppm or more is adopted.
公开/授权文献
- US09138964B2 Surface-treated copper foil 公开/授权日:2015-09-22
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