公开(公告)号：US09138964B2

公开(公告)日：2015-09-22

申请号：US13988450

申请日：2011-11-22

申请人： Shinichi Obata ,  Shinya Hiraoka ,  Fumiaki Hosokoshi ,  Ayumu Tateoka ,  Hideaki Matsushima ,  Koichi Miyake ,  Sakiko Tomonaga ,  Tomoyuki Maeda

发明人： Shinichi Obata ,  Shinya Hiraoka ,  Fumiaki Hosokoshi ,  Ayumu Tateoka ,  Hideaki Matsushima ,  Koichi Miyake ,  Sakiko Tomonaga ,  Tomoyuki Maeda

IPC分类号： C23C2/02 ,  B32B15/01 ,  C23C28/00 ,  C25D5/10 ,  C25D7/06 ,  H05K1/09 ,  H01B1/02 ,  C25D1/04 ,  C25D3/56 ,  C25D5/48 ,  C25D11/38

CPC分类号： B32B15/01 ,  C23C2/02 ,  C23C28/00 ,  C23C28/30 ,  C23C28/321 ,  C23C28/324 ,  C23C28/3455 ,  C25D1/04 ,  C25D3/565 ,  C25D5/10 ,  C25D5/48 ,  C25D7/0614 ,  C25D11/38 ,  H01B1/026 ,  H05K1/09 ,  H05K2201/0355 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12792

摘要： An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350° C. to 400° C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc alloy, and the either rust-proofing treatment layer is a zinc alloy layer having zinc amount of 20 mg/m2 to 1,000 mg/m2; and the copper foil contains one or two or more of small amount elements selected from carbon, sulfur, chlorine and nitrogen, and a sum amount thereof is 100 ppm or more is adopted.

摘要翻译： 本发明的目的是提供一种耐软化性能优异的铜箔，其在约350℃〜400℃下热处理后的抗拉强度降低。为了达到上述目的，将表面处理铜箔 在由铜合金构成的防锈处理层的铜箔的两面上设有防锈处理层，防锈处理层为锌量为20mg / m 2的锌合金层 至1,000 mg / m2; 铜箔含有一种或两种以上选自碳​​，硫，氯和氮的少量元素，其总量为100ppm以上。

公开(公告)号：US09585261B2

公开(公告)日：2017-02-28

申请号：US14008034

申请日：2012-03-29

申请人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

发明人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

IPC分类号： H05K3/30 ,  H05K3/46 ,  H05K3/02

CPC分类号： H05K3/4652 ,  H05K3/022 ,  H05K3/4658 ,  H05K3/4682 ,  Y10T29/49155

摘要： A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a carrier foil/a release layer/a heat-resistant metal layer/a copper foil layer is used; a supporting substrate is manufactured by laminating an insulating layer constituting material on the surface of the copper foil layer constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the carrier foil constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.

摘要翻译： 具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法，使用载体箔/剥离层/耐热金属层/铜箔层; 通过在构成铜箔的铜箔层的表面上与载体箔层叠绝缘层构成材料来制造支撑基板; 通过在支撑基板上通过载体箔在构成铜箔的载体箔的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

公开(公告)号：US20140096381A1

公开(公告)日：2014-04-10

申请号：US14008034

申请日：2012-03-29

申请人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

发明人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

IPC分类号： H05K3/46

CPC分类号： H05K3/4652 ,  H05K3/022 ,  H05K3/4658 ,  H05K3/4682 ,  Y10T29/49155

摘要： A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a carrier foil/a release layer/a heat-resistant metal layer/a copper foil layer is used; a supporting substrate is manufactured by laminating an insulating layer constituting material on the surface of the copper foil layer constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the carrier foil constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.

摘要翻译： 具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法，使用载体箔/剥离层/耐热金属层/铜箔层; 通过在构成铜箔的铜箔层的表面上与载体箔层叠绝缘层构成材料来制造支撑基板; 通过在支撑基板上通过载体箔在构成铜箔的载体箔的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

公开(公告)号：US20130295407A1

公开(公告)日：2013-11-07

申请号：US13988450

申请日：2011-11-22

申请人： Shinichi Obata ,  Shinya Hiraoka ,  Fumiaki Hosokoshi ,  Ayumu Tateoka ,  Hideaki Matsushima ,  Koichi Miyake ,  Sakiko Tomonaga ,  Tomoyuki Maeda

发明人： Shinichi Obata ,  Shinya Hiraoka ,  Fumiaki Hosokoshi ,  Ayumu Tateoka ,  Hideaki Matsushima ,  Koichi Miyake ,  Sakiko Tomonaga ,  Tomoyuki Maeda

IPC分类号： H01B1/02

CPC分类号： B32B15/01 ,  C23C2/02 ,  C23C28/00 ,  C23C28/30 ,  C23C28/321 ,  C23C28/324 ,  C23C28/3455 ,  C25D1/04 ,  C25D3/565 ,  C25D5/10 ,  C25D5/48 ,  C25D7/0614 ,  C25D11/38 ,  H01B1/026 ,  H05K1/09 ,  H05K2201/0355 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12792

摘要： An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350° C. to 400° C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc alloy, and the either rust-proofing treatment layer is a zinc alloy layer having zinc amount of 20 mg/m2 to 1,000 mg/m2; and the copper foil contains one or two or more of small amount elements selected from carbon, sulfur, chlorine and nitrogen, and a sum amount thereof is 100 ppm or more is adopted.

摘要翻译： 本发明的目的是提供一种耐软化性能优异的铜箔，其在约350℃〜400℃下热处理后的抗拉强度降低。为了达到上述目的，将表面处理铜箔 在由铜合金构成的防锈处理层的铜箔的两面上设有防锈处理层，防锈处理层为锌量为20mg / m 2的锌合金层 至1,000 mg / m2; 铜箔含有一种或两种以上选自碳​​，硫，氯和氮的少量元素，其总量为100ppm以上。

公开(公告)号：US20090166213A1

公开(公告)日：2009-07-02

申请号：US12089671

申请日：2006-10-31

申请人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Ayumu Tateoka ,  Hiroshi Hata ,  Satoshi Mogi ,  Takeo Taguchi ,  Junshi Yoshioka

发明人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Ayumu Tateoka ,  Hiroshi Hata ,  Satoshi Mogi ,  Takeo Taguchi ,  Junshi Yoshioka

IPC分类号： C25D3/38 ,  B32B15/04

CPC分类号： C25D3/38 ,  C25D1/04 ,  H05K1/09

摘要： An object of the present invention is to provide a production method which enables efficient production of an electro-deposited copper foil with further lower profile when compared to the low-profile electro-deposited copper foils which have been supplied to the market and is excellent in mechanical strength. For the purpose of achieving the object, a production method adopted obtains the electro-deposited copper foil by electrolyzing a sulfuric acid based copper electrolytic solution which contains a quaternary ammonium salt polymer having cyclic structure and chlorine, wherein for the quaternary ammonium salt polymer contained in the sulfuric acid based copper electrolytic solution, a DDAC dimer or higher polymer is used. For the quaternary ammonium salt polymer, a diallyl dimethyl ammonium chloride polymer having a number average molecular weight of 300 to 10000 is preferably used. The sulfuric acid based copper electrolytic solution preferably contains bis(3-sulfopropyl) disulfide or 3-mercapto-1-propanesulfonic acid that is a compound having a mercapto group.

摘要翻译： 本发明的一个目的是提供一种制造方法，该方法能够与已经供应到市场上的薄型电镀铜箔相比具有更低的轮廓的电解铜箔的有效生产 机械强度。 为了实现该目的，所采用的制造方法是通过电解含有具有环状结构和氯的季铵盐聚合物的硫酸系铜电解液得到电解铜箔，其中，对于 使用硫酸类铜电解液，DDAC二聚体或更高级聚合物。 对于季铵盐聚合物，优选使用数均分子量为300〜10000的二烯丙基二甲基氯化铵聚合物。 硫酸系铜电解液优选含有作为具有巯基的化合物的双（3-磺丙基）二硫化物或3-巯基-1-丙磺酸。

公开(公告)号：US09066459B2

公开(公告)日：2015-06-23

申请号：US14008038

申请日：2012-03-29

申请人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

发明人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

IPC分类号： H01B13/00 ,  H05K3/46 ,  H05K3/02

CPC分类号： H05K3/4611 ,  H05K3/022 ,  H05K3/4658 ,  H05K3/4682

摘要： A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a copper foil layer/a release layer/a heat-resistant metal layer/a carrier foil is used; a supporting substrate is manufactured by laminating an insulating layer constituting material to the surface of the carrier foil constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the copper foil layer constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.

摘要翻译： 使用具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法，使用铜箔层/剥离层/耐热金属层/载体箔; 通过使用载体箔将构成材料的绝缘层层叠在构成铜箔的载体箔的表面上来制造支撑基板; 通过在支撑基板上用载体箔在构成铜箔的铜箔层的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

公开(公告)号：US20140054259A1

公开(公告)日：2014-02-27

申请号：US14008038

申请日：2012-03-29

申请人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

发明人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

IPC分类号： H05K3/46

CPC分类号： H05K3/4611 ,  H05K3/022 ,  H05K3/4658 ,  H05K3/4682

摘要： A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a copper foil layer/a release layer/a heat-resistant metal layer/a carrier foil is used; a supporting substrate is manufactured by laminating an insulating layer constituting material to the surface of the carrier foil constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the copper foil layer constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.

摘要翻译： 使用具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法，使用铜箔层/剥离层/耐热金属层/载体箔; 通过使用载体箔将构成材料的绝缘层层叠在构成铜箔的载体箔的表面上来制造支撑基板; 通过在支撑基板上用载体箔在构成铜箔的铜箔层的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

公开(公告)号：US08419920B2

公开(公告)日：2013-04-16

申请号：US12444020

申请日：2007-10-02

申请人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

发明人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

IPC分类号： C25D3/38

CPC分类号： C25D3/38

摘要： An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.

摘要翻译： 本发明的目的是提供一种制备用于形成电沉积铜膜的硫酸基铜电解液的方法，该方法包括当刚制备后使用溶液形成时制备的平滑度和光泽度优异的表面，并且被制备 通过使用单硫化物。 为了实现该目的，制备硫酸基铜电解液以含有磺化活性硫化合物，推荐用于形成光滑电沉积铜膜的双（3-磺丙基）二硫化物。 通过氧化反应在3-巯基-1-丙磺酸的水溶液中将3-巯基-1-丙磺酸转化成双（3-磺丙基）二硫化物，得到所含的双（3-磺丙基）二硫化物 。 在氧化反应中，优选使用空气鼓泡法来防止3-巯基-1-丙磺酸的氧化分解。

公开(公告)号：US20130302635A1

公开(公告)日：2013-11-14

申请号：US13988236

申请日：2011-11-22

申请人： Shinichi Obata ,  Shinya Hiraoka ,  Fumiaki Hosokoshi ,  Ayumu Tateoka ,  Hideaki Matsushima ,  Koichi Miyake ,  Sakiko Tomonaga ,  Tomoyuki Maeda

发明人： Shinichi Obata ,  Shinya Hiraoka ,  Fumiaki Hosokoshi ,  Ayumu Tateoka ,  Hideaki Matsushima ,  Koichi Miyake ,  Sakiko Tomonaga ,  Tomoyuki Maeda

IPC分类号： B32B15/01

CPC分类号： B32B15/01 ,  C23C2/02 ,  C23C28/00 ,  C23C28/30 ,  C23C28/321 ,  C23C28/324 ,  C23C28/3455 ,  C25D1/04 ,  C25D3/565 ,  C25D5/10 ,  C25D5/48 ,  C25D7/0614 ,  C25D11/38 ,  H01B1/026 ,  H05K1/09 ,  H05K2201/0355 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12792

摘要： An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350° C. to 400° C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc, and the either rust-proofing treatment layer is a zinc layer having zinc amount of 20 mg/m2 to 1,000 mg/m2; and the copper foil contains one or two or more of small amount elements selected from carbon, sulfur, chlorine and nitrogen, and a sum amount thereof is 100 ppm or more is adopted.

摘要翻译： 本发明的目的是提供一种耐软化性能优异的铜箔，其在约350℃〜400℃下热处理后的抗拉强度降低。为了达到上述目的，将表面处理铜箔 在由铜构成的防锈处理层的铜箔的两面上设有防锈处理层，任一防锈处理层为锌量为20mg / m 2〜1000的锌层 mg / m2; 铜箔含有一种或两种以上选自碳​​，硫，氯和氮的少量元素，其总量为100ppm以上。

公开(公告)号：US20100089758A1

公开(公告)日：2010-04-15

申请号：US12444020

申请日：2007-10-02

申请人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

发明人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

IPC分类号： C25D3/38 ,  C25D7/00

CPC分类号： C25D3/38

摘要： An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.

摘要翻译： 本发明的目的是提供一种制备用于形成电沉积铜膜的硫酸基铜电解液的方法，该方法包括当刚制备后使用溶液形成时制备的平滑度和光泽度优异的表面，并且被制备 通过使用单硫化物。 为了实现该目的，制备硫酸基铜电解液以含有磺化活性硫化合物，推荐用于形成光滑电沉积铜膜的双（3-磺丙基）二硫化物。 通过氧化反应在3-巯基-1-丙磺酸的水溶液中将3-巯基-1-丙磺酸转化成双（3-磺丙基）二硫化物，得到所含的双（3-磺丙基）二硫化物 。 在氧化反应中，优选使用空气鼓泡法来防止3-巯基-1-丙磺酸的氧化分解。