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公开(公告)号：US09138964B2
公开(公告)日：2015-09-22
申请号：US13988450
申请日：2011-11-22
申请人： Shinichi Obata , Shinya Hiraoka , Fumiaki Hosokoshi , Ayumu Tateoka , Hideaki Matsushima , Koichi Miyake , Sakiko Tomonaga , Tomoyuki Maeda
发明人： Shinichi Obata , Shinya Hiraoka , Fumiaki Hosokoshi , Ayumu Tateoka , Hideaki Matsushima , Koichi Miyake , Sakiko Tomonaga , Tomoyuki Maeda
IPC分类号： C23C2/02 , B32B15/01 , C23C28/00 , C25D5/10 , C25D7/06 , H05K1/09 , H01B1/02 , C25D1/04 , C25D3/56 , C25D5/48 , C25D11/38
CPC分类号： B32B15/01 , C23C2/02 , C23C28/00 , C23C28/30 , C23C28/321 , C23C28/324 , C23C28/3455 , C25D1/04 , C25D3/565 , C25D5/10 , C25D5/48 , C25D7/0614 , C25D11/38 , H01B1/026 , H05K1/09 , H05K2201/0355 , Y10T428/12438 , Y10T428/12472 , Y10T428/12792
摘要： An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350° C. to 400° C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc alloy, and the either rust-proofing treatment layer is a zinc alloy layer having zinc amount of 20 mg/m2 to 1,000 mg/m2; and the copper foil contains one or two or more of small amount elements selected from carbon, sulfur, chlorine and nitrogen, and a sum amount thereof is 100 ppm or more is adopted.
摘要翻译： 本发明的目的是提供一种耐软化性能优异的铜箔，其在约350℃〜400℃下热处理后的抗拉强度降低。为了达到上述目的，将表面处理铜箔 在由铜合金构成的防锈处理层的铜箔的两面上设有防锈处理层，防锈处理层为锌量为20mg / m 2的锌合金层 至1,000 mg / m2; 铜箔含有一种或两种以上选自碳，硫，氯和氮的少量元素，其总量为100ppm以上。
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2.发明授权公开(公告)号：US08715836B2
公开(公告)日：2014-05-06
申请号：US12282231
申请日：2007-03-09
申请人： Makoto Dobashi , Mitsuyoshi Matsuda , Sakiko Tomonaga , Hisao Sakai , Tomohiro Sakata , Junshi Yoshioka , Jo Nishikawa , Takeo Taguchi
发明人： Makoto Dobashi , Mitsuyoshi Matsuda , Sakiko Tomonaga , Hisao Sakai , Tomohiro Sakata , Junshi Yoshioka , Jo Nishikawa , Takeo Taguchi
IPC分类号： H01L27/108 , H01L29/76 , H01L29/94
CPC分类号： H05K3/384 , C25D1/04 , C25D3/38 , C25D5/16 , C25D5/18 , C25D5/48 , C25D7/06 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K2203/1476 , Y10T428/12438 , Y10T428/12451 , Y10T428/12472 , Y10T428/12882 , Y10T428/12903 , Y10T428/12993 , Y10T428/24355 , Y10T428/24917
摘要： It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density.
摘要翻译： 本发明的目的是提供一种表面处理的电沉积铜箔，其具有等于或优于传统上被供应到市场的低轮廓表面处理的电沉积铜箔的等级或优异的水平， 其中影响布线直线性能的波纹小，及其制造方法。 为了实现这个目的，在表面处理的电解铜箔中，与绝缘层构成材料接合的接合面的最大波纹高度（Wmax）为0.05μm〜0.7μm，最大峰值 谷值（PV）为0.05〜1.5μm，表面粗糙度（Rzjis）为0.1μm〜1.0μm。 用于制造该表面处理的电解铜箔的电沉积铜箔通过使用通过加入3-巯基-1-丙磺酸或双（3-磺丙基）二硫化物得到的硫酸基铜电解液制备 ，具有环状结构的季铵盐聚合物和氯，并且在电解条件下使用具有小表面粗糙度的阴极，在连续的第一步电解下进行两步或更多不同电流水平的n步电解 密度。
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3.发明授权Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil 有权电沉积铜箔，其制造方法，使用电沉积铜箔的表面处理的电沉积铜箔和使用表面处理的电沉积铜箔的覆铜层压板和印刷线路板公开(公告)号：US08722199B2
公开(公告)日：2014-05-13
申请号：US11910050
申请日：2006-03-31
IPC分类号： B32B3/00
CPC分类号： C25D1/04 , C25D3/38 , C25D5/48 , H05K1/0393 , H05K1/09 , H05K2201/0355 , Y10T428/12451 , Y10T428/12472 , Y10T428/12882 , Y10T428/12903 , Y10T428/12993 , Y10T428/24917
摘要： It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.
摘要翻译： 本发明的目的是提供一种电镀铜箔，其具有比市面上通常提供的低轮廓电沉积铜箔更低的轮廓和更高的光泽度。 为了实现该目的，本发明采用电沉积铜箔，其具有超薄型，沉积面的表面粗糙度（Rzjis）低于1.0微米，光泽[Gs（60度）] 的厚度不低于400。 本发明还提供一种通过使用通过加入3-巯基-1-丙磺酸和/或二（3-磺丙基）二硫化物得到的硫酸基铜电解液电沉积获得的电沉积铜箔的制备方法，季铵盐 具有环状结构的聚合物和氯。
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4.发明申请METHOD FOR MANUFACTURING COPPER FOIL FOR NEGATIVE ELECTRODE CURRENT COLLECTOR 审中-公开用于制造负极电流集电器的铜箔的方法公开(公告)号：US20130306486A1
公开(公告)日：2013-11-21
申请号：US13807091
申请日：2011-06-29
IPC分类号： H01M4/04
CPC分类号： H01M4/0452 , C23C22/24 , C23C22/68 , C25D1/04 , C25D7/0614 , C25D9/08 , H01M4/661 , H01M4/667 , H01M10/0525
摘要： An object of the present invention is to provide a method for manufacturing a copper foil for a negative electrode current collector (specifically, copper foil for a negative electrode current collector of a lithium ion secondary battery) more excellent in discoloration resistance to improve charge/discharge cycle life of a secondary battery. To achieve the object, a method for manufacturing a copper foil for a negative electrode current collector of a secondary battery subjecting the copper foil to rust-proofing treatment, the method characterized in that the copper foil is rust-proofing treated with a chromate-treatment solution having pH in the range from 3.5 to 7.0 to form a chromate film on the surface of the copper foil is employed.
摘要翻译： 本发明的目的是提供一种用于制造耐变色性优异的负极集电体（特别是锂离子二次电池用负极集电体用铜箔）的铜箔的制造方法，以提高充放电性 二次电池的循环寿命。 为了实现该目的，提供了一种用于制造用于对铜箔进行防锈处理的二次电池的负极集电体的铜箔的方法，其特征在于，所述铜箔用铬酸盐处理进行防锈处理 使用pH为3.5〜7.0的溶液，在铜箔的表面形成铬酸盐膜。
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公开(公告)号：US20130295407A1
公开(公告)日：2013-11-07
申请号：US13988450
申请日：2011-11-22
申请人： Shinichi Obata , Shinya Hiraoka , Fumiaki Hosokoshi , Ayumu Tateoka , Hideaki Matsushima , Koichi Miyake , Sakiko Tomonaga , Tomoyuki Maeda
发明人： Shinichi Obata , Shinya Hiraoka , Fumiaki Hosokoshi , Ayumu Tateoka , Hideaki Matsushima , Koichi Miyake , Sakiko Tomonaga , Tomoyuki Maeda
IPC分类号： H01B1/02
CPC分类号： B32B15/01 , C23C2/02 , C23C28/00 , C23C28/30 , C23C28/321 , C23C28/324 , C23C28/3455 , C25D1/04 , C25D3/565 , C25D5/10 , C25D5/48 , C25D7/0614 , C25D11/38 , H01B1/026 , H05K1/09 , H05K2201/0355 , Y10T428/12438 , Y10T428/12472 , Y10T428/12792
摘要： An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350° C. to 400° C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc alloy, and the either rust-proofing treatment layer is a zinc alloy layer having zinc amount of 20 mg/m2 to 1,000 mg/m2; and the copper foil contains one or two or more of small amount elements selected from carbon, sulfur, chlorine and nitrogen, and a sum amount thereof is 100 ppm or more is adopted.
摘要翻译： 本发明的目的是提供一种耐软化性能优异的铜箔，其在约350℃〜400℃下热处理后的抗拉强度降低。为了达到上述目的，将表面处理铜箔 在由铜合金构成的防锈处理层的铜箔的两面上设有防锈处理层，防锈处理层为锌量为20mg / m 2的锌合金层 至1,000 mg / m2; 铜箔含有一种或两种以上选自碳，硫，氯和氮的少量元素，其总量为100ppm以上。
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6.发明申请PRODUCTION METHOD OF ELECTRO-DEPOSITED COPPER FOIL, ELECTRO-DEPOSITED COPPER FOIL OBTAINED BY THE PRODUCTION METHOD, SURFACE-TREATED COPPER FOIL OBTAINED BY USING THE ELECTRO-DEPOSITED COPPER FOIL AND COPPER-CLAD LAMINATE OBTAINED BY USING THE ELECTRO-DEPOSITED COPPER FOIL OR THE SURFACE-TREATED COPPER FOIL 审中-公开由生产方法获得的电沉积铜箔，电沉积铜箔的生产方法，使用电沉积铜箔获得的表面处理铜箔和使用电沉积铜箔获得的铜箔层压板 表面处理铜箔公开(公告)号：US20090166213A1
公开(公告)日：2009-07-02
申请号：US12089671
申请日：2006-10-31
申请人： Makoto Dobashi , Mitsuyoshi Matsuda , Sakiko Tomonaga , Hisao Sakai , Tomohiro Sakata , Ayumu Tateoka , Hiroshi Hata , Satoshi Mogi , Takeo Taguchi , Junshi Yoshioka
发明人： Makoto Dobashi , Mitsuyoshi Matsuda , Sakiko Tomonaga , Hisao Sakai , Tomohiro Sakata , Ayumu Tateoka , Hiroshi Hata , Satoshi Mogi , Takeo Taguchi , Junshi Yoshioka
摘要： An object of the present invention is to provide a production method which enables efficient production of an electro-deposited copper foil with further lower profile when compared to the low-profile electro-deposited copper foils which have been supplied to the market and is excellent in mechanical strength. For the purpose of achieving the object, a production method adopted obtains the electro-deposited copper foil by electrolyzing a sulfuric acid based copper electrolytic solution which contains a quaternary ammonium salt polymer having cyclic structure and chlorine, wherein for the quaternary ammonium salt polymer contained in the sulfuric acid based copper electrolytic solution, a DDAC dimer or higher polymer is used. For the quaternary ammonium salt polymer, a diallyl dimethyl ammonium chloride polymer having a number average molecular weight of 300 to 10000 is preferably used. The sulfuric acid based copper electrolytic solution preferably contains bis(3-sulfopropyl) disulfide or 3-mercapto-1-propanesulfonic acid that is a compound having a mercapto group.
摘要翻译： 本发明的一个目的是提供一种制造方法，该方法能够与已经供应到市场上的薄型电镀铜箔相比具有更低的轮廓的电解铜箔的有效生产 机械强度。 为了实现该目的，所采用的制造方法是通过电解含有具有环状结构和氯的季铵盐聚合物的硫酸系铜电解液得到电解铜箔，其中，对于 使用硫酸类铜电解液，DDAC二聚体或更高级聚合物。 对于季铵盐聚合物，优选使用数均分子量为300〜10000的二烯丙基二甲基氯化铵聚合物。 硫酸系铜电解液优选含有作为具有巯基的化合物的双（3-磺丙基）二硫化物或3-巯基-1-丙磺酸。
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7.发明申请公开(公告)号：US20090047539A1
公开(公告)日：2009-02-19
申请号：US12282231
申请日：2007-03-09
申请人： Makoto Dobashi , Mitsuyoshi Matsuda , Sakiko Tomonaga , Hisao Sakai , Tomohiro Sakata , Junshi Yoshioka , Jo Nishikawa , Takeo Taguchi
发明人： Makoto Dobashi , Mitsuyoshi Matsuda , Sakiko Tomonaga , Hisao Sakai , Tomohiro Sakata , Junshi Yoshioka , Jo Nishikawa , Takeo Taguchi
CPC分类号： H05K3/384 , C25D1/04 , C25D3/38 , C25D5/16 , C25D5/18 , C25D5/48 , C25D7/06 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K2203/1476 , Y10T428/12438 , Y10T428/12451 , Y10T428/12472 , Y10T428/12882 , Y10T428/12903 , Y10T428/12993 , Y10T428/24355 , Y10T428/24917
摘要： It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density.
摘要翻译： 本发明的目的是提供一种表面处理的电沉积铜箔，其具有等于或优于传统上被供应到市场的低轮廓表面处理的电沉积铜箔的等级或优异的水平， 其中影响布线直线性能的波纹小，及其制造方法。 为了实现这个目的，在表面处理的电解铜箔中，与绝缘层构成材料接合的接合面的最大波纹高度（Wmax）为0.05μm〜0.7μm，最大峰值 谷值（PV）为0.05〜1.5μm，表面粗糙度（Rzjis）为0.1μm〜1.0μm。 用于制造该表面处理的电解铜箔的电沉积铜箔通过使用通过加入3-巯基-1-丙磺酸或双（3-磺丙基）二硫化物得到的硫酸基铜电解液制备 ，具有环状结构的季铵盐聚合物和氯，并且在电解条件下使用具有小表面粗糙度的阴极，在连续的第一步电解下进行两步或更多不同电流水平的n步电解 密度。
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8.发明授权Titanium-made cathode electrode for producing electrolytic copper foil, rotary cathode drum using the titanium-made cathode electrode, method of producing titanium material using titanium-made cathode electrode and method of correcting/working titanium material for titanium-made cathode electrode 失效用于制造电解铜箔的钛制阴极电极，使用该钛制阴极的旋转阴极筒，使用钛制阴极电极制造钛材料的方法和用于钛制阴极电极的钛材料的校正/加工方法公开(公告)号：US07029558B2
公开(公告)日：2006-04-18
申请号：US10203472
申请日：2001-12-26
申请人： Sakiko Tomonaga , Satoru Fujita , Hiroshi Tanaka , Yutaka Kiminami , Isamu Kanekatsu , Atsuhiko Kuroda
发明人： Sakiko Tomonaga , Satoru Fujita , Hiroshi Tanaka , Yutaka Kiminami , Isamu Kanekatsu , Atsuhiko Kuroda
IPC分类号： C25B11/04
CPC分类号： C25D1/04 , B21B3/00 , B21B2045/006
摘要： The purpose is to provide a cathode electrode for manufacturing an electrodeposited copper foil which is possible to be continuously and stably usable for a long duration of 3000 hours or longer to subsequently lessen the frequency of maintenance work execution as low as possible and to contribute to lower the running cost of the electrodeposited copper foil manufacture. As the means for achieving the purpose, a cathode electrode made of a titanium material is employed for obtaining an electrodeposited copper foil using an electrolytic copper solution and the titanium material having 7.0 or higher crystal grain size number and 35 ppm or lower initial hydrogen content is used for manufacturing the cathode electrode for manufacturing an electrodeposited copper foil. Further, also provided is a manufacturing method of the titanium material to be employed for the cathode electrode made of a titanium material.
摘要翻译： 其目的是提供一种用于制造电沉积铜箔的阴极电极，其可以连续稳定地使用长达3000小时以上的长时间，从而尽可能地降低维护工作执行的频率，并且有助于降低 电沉积铜箔制造的运行成本。 作为实现目的的手段，使用由钛材料制成的阴极，以获得使用电解铜溶液的电沉积铜箔，并且具有7.0或更高的晶粒度数和35ppm或更低的初始氢含量的钛材料是 用于制造用于制造电沉积铜箔的阴极。 此外，还提供了用于由钛材料制成的阴极的钛材料的制造方法。
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9.发明申请METHOD OF MANUFACTURING NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY BATTERY, AND NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY BATTERY 审中-公开用于锂离子二次电池的负极电极材料的制造方法以及用于锂离子二次电池的负极电极材料公开(公告)号：US20140170489A1
公开(公告)日：2014-06-19
申请号：US14236689
申请日：2012-08-03
IPC分类号： H01M4/1395
CPC分类号： H01M4/1395 , H01M4/0404 , H01M4/133 , H01M4/134 , H01M4/1393 , H01M4/364 , H01M4/386 , H01M4/387 , H01M4/587 , H01M4/661 , H01M4/662 , H01M4/667 , H01M10/052 , H01M2004/027
摘要： In manufacturing of a negative electrode material of a lithium ion secondary battery provided with a negative electrode mixture layer including a negative electrode active substance on a surface of a negative electrode current collector, one or mixture selected from granular materials alloyable with lithium and carbon materials for storing and releasing lithium is used as the negative electrode active substance; manufacturing method of a negative electrode material for a lithium ion secondary battery employed is characterized in that an electro-deposited copper foil in which a surface roughness (Ra) is 0.20 μm
摘要翻译： 在负极集电体的表面具有负极活性物质的负极混合层的锂离子二次电池的负极材料的制造中，选自与锂和碳材料合金化的粒状材料中的一种或混合物， 锂的存储和释放被用作负极活性物质; 所用的锂离子二次电池用负极材料的制造方法的特征在于，表面粗糙度（Ra）为0.20μm
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10.发明申请COPPER FOIL PROVIDED WITH CHROMATE FILM FOR NEGATIVE ELECTRODE CURRENT COLLECTOR, AND NEGATIVE ELECTRODE MATERIAL USING THE COPPER FOIL PROVIDED WITH CHROMATE FILM FOR NEGATIVE ELECTRODE CURRENT COLLECTOR 审中-公开用于负极电流集电器的铬酸盐膜的铜箔和使用用于阴极电极集电器的带有铬酸盐膜的铜箔的负极电极材料公开(公告)号：US20140127569A1
公开(公告)日：2014-05-08
申请号：US14110778
申请日：2012-04-10
申请人： Tomoyuki Maeda , Sakiko Tomonaga , Yasunori Tabira
发明人： Tomoyuki Maeda , Sakiko Tomonaga , Yasunori Tabira
IPC分类号： H01M4/66
CPC分类号： H01M4/665 , C23C22/24 , C25D1/04 , C25D9/08 , C25D11/38 , H01M4/13 , H01M4/661 , H01M4/667 , H01M10/0525
摘要： An object of the present invention is to eliminate deviation in the quality of a chromate film provided on a copper foil for a negative electrode current collector to eliminate fluctuation of electric capacity in a lithium ion secondary battery.To achieve the object, as the copper foil for a negative electrode current collector of a lithium ion secondary battery, a copper foil provided with a chromate film for a negative electrode current collector in which Cr(OH)3 constitutes 85 area % or more of the chromate film is employed. Further, the copper foil provided with a chromate film for a negative electrode current collector according to the present application is preferable to be that the apparent orientation number N of oxygen closest to chrome in the chromate film is 4.5 or more.
摘要翻译： 本发明的目的是消除设置在负极集电体的铜箔上的铬酸盐膜的质量偏差，以消除锂离子二次电池中的电容的波动。 为了实现该目的，作为锂离子二次电池的负极集电体用铜箔，设置有负极集电体用铬酸盐膜的铜箔，其中Cr（OH）3的面积％以上为85面积％以上 使用铬酸盐膜。 此外，根据本申请的设置有负极集电体的铬酸盐膜的铜箔优选为铬酸盐膜中最接近铬的氧的表观取向数N为4.5以上。
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