发明申请
US20130309865A1 METHOD OF MANUFACTURING SUBSTRATE FOR MOUNTING ELECTRONIC DEVICE
审中-公开
用于安装电子设备的基板的制造方法
- 专利标题： METHOD OF MANUFACTURING SUBSTRATE FOR MOUNTING ELECTRONIC DEVICE
- 专利标题（中）： 用于安装电子设备的基板的制造方法
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申请号： US13894170申请日： 2013-05-14
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公开(公告)号： US20130309865A1公开(公告)日： 2013-11-21
- 发明人: Shi Young LEE , Tae Hyung KIM , Gi Bum KIM , Yu Seung KIM , Ju Hyun KIM , Jin Gi HONG
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 优先权： KR10-2012-0052119 20120516
- 主分类号： H01L21/768
- IPC分类号： H01L21/768
摘要：
There is provided a method of manufacturing a substrate for mounting an electronic device. The method includes disposing a protective layer on a surface of the substrate except for an edge portion thereof . An oxide film is disposed on the entirety of the surface of the substrate except for where the protective layer is disposed The oxide film is grown. A through hole is formed in a thickness direction of the substrate by selectively etching the protective layer. The oxide film is removed. In the manufacturing method, defects in the substrate for mounting an electronic device may be reduced and manufacturing costs can be reduced.
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