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公开(公告)号：US20130309865A1
公开(公告)日：2013-11-21
申请号：US13894170
申请日：2013-05-14
发明人： Shi Young LEE , Tae Hyung KIM , Gi Bum KIM , Yu Seung KIM , Ju Hyun KIM , Jin Gi HONG
IPC分类号： H01L21/768
CPC分类号： H01L21/76802 , H01L21/3083 , H01L21/76898 , H01L2933/0033
摘要： There is provided a method of manufacturing a substrate for mounting an electronic device. The method includes disposing a protective layer on a surface of the substrate except for an edge portion thereof . An oxide film is disposed on the entirety of the surface of the substrate except for where the protective layer is disposed The oxide film is grown. A through hole is formed in a thickness direction of the substrate by selectively etching the protective layer. The oxide film is removed. In the manufacturing method, defects in the substrate for mounting an electronic device may be reduced and manufacturing costs can be reduced.
摘要翻译： 提供了一种制造用于安装电子设备的基板的方法。 该方法包括在除了其边缘部分之外的基板的表面上设置保护层。 除了设置保护层的地方之外，氧化膜设置在基板的整个表面上，生长氧化膜。 通过选择性地蚀刻保护层，在基板的厚度方向上形成通孔。 去除氧化膜。 在制造方法中，可以减少用于安装电子设备的基板中的缺陷，并且可以降低制造成本。
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公开(公告)号：US20150104944A1
公开(公告)日：2015-04-16
申请号：US14276502
申请日：2014-05-13
发明人： Ki Won PARK , Ju Hyun KIM , Yu Seung KIM , Sang Yeob SONG , Tae Hyun LEE
IPC分类号： H01L21/308
CPC分类号： H01L21/0331 , H01L33/10 , H01L2933/0016
摘要： There is provided a method of forming patterns for a semiconductor device. The method sequentially forming a first mask layer and a second mask layer on a substrate. The method also includes forming a second mask pattern layer by patterning the second mask layer. The method further includes forming a first mask pattern layer having a negative slope portion, by etching the first mask layer exposed through the second mask pattern layer. The method also includes forming a thin film layer on the substrate exposed through the first mask pattern layer.
摘要翻译： 提供了一种形成半导体器件的图案的方法。 该方法在衬底上依次形成第一掩模层和第二掩模层。 该方法还包括通过图案化第二掩模层来形成第二掩模图案层。 该方法还包括通过蚀刻通过第二掩模图案层暴露的第一掩模层来形成具有负斜率部分的第一掩模图案层。 该方法还包括在通过第一掩模图案层暴露的衬底上形成薄膜层。
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公开(公告)号：US20170323999A1
公开(公告)日：2017-11-09
申请号：US15604469
申请日：2017-05-24
发明人： Pun Jae CHOI , Yu Seung KIM , Jin Bock LEE
CPC分类号： H01L33/0075 , H01L33/0079 , H01L33/08 , H01L33/20 , H01L33/22 , H01L33/38 , H01L33/382 , H01L33/40 , H01L33/405 , H01L33/42 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2933/0016
摘要： There is provided a semiconductor light emitting device including a conductive substrate, a first electrode layer, an insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked. The contact area between the first electrode layer and the first semiconductor layer is 3% to 13% of the total area of the semiconductor light emitting device, and thus high luminous efficiency is achieved.
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4.发明申请公开(公告)号：US20160241542A1
公开(公告)日：2016-08-18
申请号：US15010027
申请日：2016-01-29
发明人： Tae Hyun KIM , Young Sik KIM , Yu Seung KIM , Dong Ho JANG
IPC分类号： H04L29/06
CPC分类号： H04L63/083 , G06F21/36 , H04W12/06
摘要： An electronic device and authentication processing method for operating the electronic device is provided. The authentication processing method includes transmitting to an external server credential information input in the electronic device through a user interface, receiving an authentication request of the credential information, processing the authentication request based on the credential information stored in the electronic device, or determining whether to transmit the authentication request through the communication module based on the credential information stored in the external server.
摘要翻译： 提供了一种用于操作电子设备的电子设备和认证处理方法。 认证处理方法包括通过用户接口向外部服务器发送输入电子设备的凭证信息，接收认证信息的认证请求，基于存储在电子设备中的认证信息来处理认证请求，或者确定是否 基于存储在外部服务器中的凭证信息，通过通信模块发送认证请求。
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公开(公告)号：US20150001463A1
公开(公告)日：2015-01-01
申请号：US14336973
申请日：2014-07-21
发明人： Pun Jae . CHOI , Sang Bum LEE , Jin Bock LEE , Yu Seung KIM , Sang Yeob SONG
CPC分类号： H01L25/13 , H01L25/0753 , H01L33/002 , H01L33/0025 , H01L33/0029 , H01L33/08 , H01L33/20 , H01L33/22 , H01L33/382 , H01L33/387 , H01L33/40 , H01L33/44 , H01L33/486 , H01L33/502 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/54 , H01L33/56 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49175 , H01L2224/8592 , H01L2924/0002 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H01L2933/0041 , H05B33/0803 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In a semiconductor light emitting device, a light emitting structure includes a first-conductivity type semiconductor layer, an active layer, and a second-conductivity type semiconductor layer, which are sequentially formed on a conductive substrate. A second-conductivity type electrode includes a conductive via and an electrical connection part. The conductive via passes through the first-conductivity type semiconductor layer and the active layer, and is connected to the inside of the second-conductivity type semiconductor layer. The electrical connection part extends from the conductive via and is exposed to the outside of the light emitting structure. An insulator electrically separates the second-conductivity type electrode from the conductive substrate, the first-conductivity type semiconductor layer, and the active layer. A passivation layer is formed to cover at least a side surface of the active layer in the light emitting structure. An uneven structure is formed on a path of light emitted from the active layer.
摘要翻译： 在半导体发光器件中，发光结构包括依次形成在导电基板上的第一导电型半导体层，有源层和第二导电型半导体层。 第二导电型电极包括导电孔和电连接部。 导电通孔穿过第一导电类型半导体层和有源层，并连接到第二导电类型半导体层的内部。 电连接部分从导电通孔延伸并暴露于发光结构的外部。 绝缘体将第二导电型电极与导电基板，第一导电型半导体层和有源层电隔离。 形成钝化层以覆盖发光结构中的有源层的至少一个侧表面。 在从有源层发射的光的路径上形成不均匀结构。
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公开(公告)号：US20180351033A1
公开(公告)日：2018-12-06
申请号：US15992822
申请日：2018-05-30
发明人： Pun Jae CHOI , Yu Seung KIM , Jin Bock LEE
CPC分类号： H01L33/0075 , H01L33/0079 , H01L33/08 , H01L33/20 , H01L33/22 , H01L33/38 , H01L33/382 , H01L33/40 , H01L33/405 , H01L33/42 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2933/0016
摘要： There is provided a semiconductor light emitting device including a conductive substrate, a first electrode layer, an insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked. The contact area between the first electrode layer and the first semiconductor layer is 3% to 13% of the total area of the semiconductor light emitting device, and thus high luminous efficiency is achieved.
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公开(公告)号：US20170048236A1
公开(公告)日：2017-02-16
申请号：US15226228
申请日：2016-08-02
发明人： In Ku KANG , Young Sik KIM , Yu Seung KIM , Tae Hyun KIM , Dushyant VIPRADAS
CPC分类号： H04L63/0815 , G06F8/61 , G06F21/31 , H04L63/083 , H04L67/1095 , H04W4/00
摘要： An electronic device and a method for commonly using the electronic device are provided. The electronic device includes a housing, a memory disposed in the housing, a communication circuit in communication with at least one external device, and a processor electrically connected to the memory and the communication circuit. The processor is configured to control for installing at least one application on the memory in response to a login request from a user, receiving a logout request from the user after the at least one application is installed, transmitting data associated with the at least one application to the at least one external device using the communication circuit in response to the logout request, and deleting at least a portion of the at least one application and the data associated with the at least one application from the memory.
摘要翻译： 提供一种电子设备和一种通常使用电子设备的方法。 电子设备包括壳体，设置在壳体中的存储器，与至少一个外部设备通信的通信电路，以及与存储器和通信电路电连接的处理器。 所述处理器被配置为响应于来自用户的登录请求来控制在所述存储器上安装至少一个应用，在所述至少一个应用被安装之后从所述用户接收注销请求，发送与所述至少一个应用相关联的数据 使用所述通信电路响应于所述注销请求到所述至少一个外部设备，以及从所述存储器中删除所述至少一个应用的至少一部分和与所述至少一个应用相关联的数据。
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公开(公告)号：US20160308089A1
公开(公告)日：2016-10-20
申请号：US14993066
申请日：2016-01-11
发明人： Hyung Kun KIM , Si Han KIM , Yu Seung KIM , Jung Jin KIM
CPC分类号： H01L33/0095 , H01L33/486 , H01L33/504 , H01L33/505 , H01L33/54 , H01L33/58 , H01L2933/0041 , H01L2933/005 , H01L2933/0058
摘要： Method of manufacturing a semiconductor light emitting device package are described. Semiconductor light emitting device packages includes may be formed by forming a plurality of light emitting diode chips having a structure in which a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer are sequentially stacked on a wafer, forming a phosphor layer and an encapsulation layer on the first conductivity-type semiconductor layer, forming a texture on the encapsulation layer by removing a portion of the encapsulation layer from an upper surface thereof; and separating the plurality of light emitting diode chips from each other.
摘要翻译： 描述制造半导体发光器件封装的方法。 半导体发光器件封装可以通过形成多个具有第一导电型半导体层，有源层和第二导电类型半导体层依次层叠在晶片上的结构的发光二极管芯片形成， 在所述第一导电型半导体层上形成荧光体层和封装层，通过从其上表面去除所述封装层的一部分，在所述封装层上形成纹理; 以及将所述多个发光二极管芯片彼此分离。
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公开(公告)号：US20160241548A1
公开(公告)日：2016-08-18
申请号：US15041803
申请日：2016-02-11
发明人： Yu Seung KIM , In Ku Kang
摘要： An electronic device and a method for operating the electronic device are provided. The method includes obtaining first information in a first zone of the electronic device, extracting second information included in the first information in the first zone of the electronic device, and storing the second information in a second zone of the electronic device that has a higher level of security than a level of security of the first zone.
摘要翻译： 提供一种用于操作电子设备的电子设备和方法。 该方法包括获取电子设备的第一区域中的第一信息，提取包括在电子设备的第一区域中的第一信息中的第二信息，并将第二信息存储在具有较高级别的电子设备的第二区域中 的安全性比第一个区域的安全级别。
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公开(公告)号：US20140070263A1
公开(公告)日：2014-03-13
申请号：US14080455
申请日：2013-11-14
发明人： Pun Jae CHOI , Yu Seung KIM , Jin Bock LEE
IPC分类号： H01L33/40
CPC分类号： H01L33/0075 , H01L33/0079 , H01L33/08 , H01L33/20 , H01L33/22 , H01L33/38 , H01L33/382 , H01L33/40 , H01L33/405 , H01L33/42 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2933/0016
摘要： There is provided a semiconductor light emitting device including a conductive substrate, a first electrode layer, an insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked. The contact area between the first electrode layer and the first semiconductor layer is 3% to 13% of the total area of the semiconductor light emitting device, and thus high luminous efficiency is achieved.
摘要翻译： 提供一种半导体发光器件，其包括依次堆叠的导电衬底，第一电极层，绝缘层，第二电极层，第二半导体层，有源层和第一半导体层。 第一电极层和第一半导体层之间的接触面积为半导体发光元件的总面积的3〜13％，实现了高的发光效率。
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