公开(公告)号：US20130309865A1

公开(公告)日：2013-11-21

申请号：US13894170

申请日：2013-05-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shi Young LEE ,  Tae Hyung KIM ,  Gi Bum KIM ,  Yu Seung KIM ,  Ju Hyun KIM ,  Jin Gi HONG

IPC: H01L21/768

CPC classification number: H01L21/76802 ,  H01L21/3083 ,  H01L21/76898 ,  H01L2933/0033

Abstract: There is provided a method of manufacturing a substrate for mounting an electronic device. The method includes disposing a protective layer on a surface of the substrate except for an edge portion thereof . An oxide film is disposed on the entirety of the surface of the substrate except for where the protective layer is disposed The oxide film is grown. A through hole is formed in a thickness direction of the substrate by selectively etching the protective layer. The oxide film is removed. In the manufacturing method, defects in the substrate for mounting an electronic device may be reduced and manufacturing costs can be reduced.

Abstract translation: 提供了一种制造用于安装电子设备的基板的方法。 该方法包括在除了其边缘部分之外的基板的表面上设置保护层。 除了设置保护层的地方之外，氧化膜设置在基板的整个表面上，生长氧化膜。 通过选择性地蚀刻保护层，在基板的厚度方向上形成通孔。 去除氧化膜。 在制造方法中，可以减少用于安装电子设备的基板中的缺陷，并且可以降低制造成本。