发明申请
US20130335921A1 SUBSTRATE FOR POWER MODULE, SUBSTRATE WITH HEAT SINK FOR POWER MODULE, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE, AND METHOD FOR PRODUCING SUBSTRATE WITH HEAT SINK FOR POWER MODULE
有权
用于功率模块的基板，具有用于功率模块的热阱的基板，功率模块，用于产生功率模块的基板的方法，以及用于为功率模块生产具有散热片的基板的方法
- 专利标题： SUBSTRATE FOR POWER MODULE, SUBSTRATE WITH HEAT SINK FOR POWER MODULE, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE, AND METHOD FOR PRODUCING SUBSTRATE WITH HEAT SINK FOR POWER MODULE
- 专利标题（中）： 用于功率模块的基板，具有用于功率模块的热阱的基板，功率模块，用于产生功率模块的基板的方法，以及用于为功率模块生产具有散热片的基板的方法
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申请号： US13503126申请日： 2010-10-19
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公开(公告)号： US20130335921A1公开(公告)日： 2013-12-19
- 发明人: Yoshiyuki Nagatomo , Kazuhiro Akiyama , Hiroshi Tonomura , Nobuyuki Terasaki , Yoshirou Kuromitsu
- 申请人： Yoshiyuki Nagatomo , Kazuhiro Akiyama , Hiroshi Tonomura , Nobuyuki Terasaki , Yoshirou Kuromitsu
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI MATERIALS CORPORATION
- 当前专利权人： MITSUBISHI MATERIALS CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2009-243259 20091022; JP2010-045747 20100302; JP2010-091366 20100412; JP2010-217590 20100928; JP2010-217591 20100928
- 国际申请： PCT/JP2010/068332 WO 20101019
- 主分类号： H05K7/02
- IPC分类号： H05K7/02 ; H05K13/00 ; H05K7/20
摘要：
Provided is a power module substrate including a ceramic substrate, and a metal plate which contains aluminum or an aluminum alloy, and which is stacked and bonded on a surface of the ceramic substrate, wherein one or more additional elements selected from Ag, Zn, Ge, Mg, Ca, Ga, and Li are solid-solubilized in the metal plate, and the Ag concentration in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.05% by mass and less than or equal to 10% by mass, or the total concentration of Zn, Ge, Mg, Ca, Ga, and Li in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.01% by mass and less than or equal to 5% by mass.
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