公开(公告)号：US20130335921A1

公开(公告)日：2013-12-19

申请号：US13503126

申请日：2010-10-19

申请人： Yoshiyuki Nagatomo ,  Kazuhiro Akiyama ,  Hiroshi Tonomura ,  Nobuyuki Terasaki ,  Yoshirou Kuromitsu

发明人： Yoshiyuki Nagatomo ,  Kazuhiro Akiyama ,  Hiroshi Tonomura ,  Nobuyuki Terasaki ,  Yoshirou Kuromitsu

IPC分类号： H05K7/02 ,  H05K13/00 ,  H05K7/20

CPC分类号： H05K7/02 ,  C04B35/645 ,  C04B37/021 ,  C04B37/026 ,  C04B2235/6581 ,  C04B2235/72 ,  C04B2237/12 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/55 ,  C04B2237/58 ,  C04B2237/60 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/86 ,  H01L21/4882 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/473 ,  H01L2224/32225 ,  H05K7/2039 ,  H05K13/00 ,  Y10T29/49002

摘要： Provided is a power module substrate including a ceramic substrate, and a metal plate which contains aluminum or an aluminum alloy, and which is stacked and bonded on a surface of the ceramic substrate, wherein one or more additional elements selected from Ag, Zn, Ge, Mg, Ca, Ga, and Li are solid-solubilized in the metal plate, and the Ag concentration in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.05% by mass and less than or equal to 10% by mass, or the total concentration of Zn, Ge, Mg, Ca, Ga, and Li in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.01% by mass and less than or equal to 5% by mass.

摘要翻译： 提供了一种功率模块基板，其包括陶瓷基板和包含铝或铝合金的金属板，并且其被堆叠并结合在陶瓷基板的表面上，其中一个或多个选自Ag，Zn，Ge的附加元素 ，Mg，Ca，Ga和Li固溶在金属板中，金属板中与陶瓷基板界面附近的Ag浓度大于或等于0.05质量％且小于或等于 等于10质量％，或者与陶瓷基板的界面附近的金属板中的Zn，Ge，Mg，Ca，Ga和Li的总浓度大于等于0.01质量％ 以上5质量％以下。

公开(公告)号：US09414512B2

公开(公告)日：2016-08-09

申请号：US13503126

申请日：2010-10-19

申请人： Yoshiyuki Nagatomo ,  Kazuhiro Akiyama ,  Nobuyuki Terasaki ,  Yoshirou Kuromitsu

发明人： Yoshiyuki Nagatomo ,  Kazuhiro Akiyama ,  Hiroshi Tonomura ,  Nobuyuki Terasaki ,  Yoshirou Kuromitsu

IPC分类号： H05K7/02 ,  H05K13/00 ,  H05K7/20 ,  H01L23/373 ,  H01L23/473 ,  C04B35/645 ,  C04B37/02 ,  H01L21/48

CPC分类号： H05K7/02 ,  C04B35/645 ,  C04B37/021 ,  C04B37/026 ,  C04B2235/6581 ,  C04B2235/72 ,  C04B2237/12 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/55 ,  C04B2237/58 ,  C04B2237/60 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/86 ,  H01L21/4882 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/473 ,  H01L2224/32225 ,  H05K7/2039 ,  H05K13/00 ,  Y10T29/49002

摘要： Provided is a power module substrate including a ceramic substrate, and a metal plate which contains aluminum or an aluminum alloy, and which is stacked and bonded on a surface of the ceramic substrate, wherein one or more additional elements selected from Ag, Zn, Ge, Mg, Ca, Ga, and Li are solid-solubilized in the metal plate, and the Ag concentration in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.05% by mass and less than or equal to 10% by mass, or the total concentration of Zn, Ge, Mg, Ca, Ga, and Li in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.01% by mass and less than or equal to 5% by mass.

摘要翻译： 提供了一种功率模块基板，其包括陶瓷基板和包含铝或铝合金的金属板，并且其被堆叠并结合在陶瓷基板的表面上，其中一个或多个选自Ag，Zn，Ge的附加元素 ，Mg，Ca，Ga和Li固溶在金属板中，金属板中与陶瓷基板界面附近的Ag浓度大于或等于0.05质量％且小于或等于 等于10质量％，或者与陶瓷基板的界面附近的金属板中的Zn，Ge，Mg，Ca，Ga和Li的总浓度大于等于0.01质量％ 以上5质量％以下。

公开(公告)号：US08564118B2

公开(公告)日：2013-10-22

申请号：US12737042

申请日：2009-06-05

申请人： Yoshirou Kuromitsu ,  Yoshiyuki Nagatomo ,  Takeshi Kitahara ,  Hiroshi Tonomura ,  Kazuhiro Akiyama

发明人： Yoshirou Kuromitsu ,  Yoshiyuki Nagatomo ,  Takeshi Kitahara ,  Hiroshi Tonomura ,  Kazuhiro Akiyama

IPC分类号： H01L23/15 ,  H01L23/06 ,  H01L23/10

CPC分类号： H01L21/76838 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  C04B2237/407 ,  H01L23/3735 ,  H01L23/498 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2924/01322 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  Y10T29/49117 ,  Y10T428/12056 ,  Y10T428/12486 ,  Y10T428/12576 ,  Y10T428/12611 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01029 ,  H01L2924/00

摘要： A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %.

摘要翻译： 功率模块基板包括：具有表面的陶瓷基板; 以及在陶瓷基板和金属板之间的接合界面处连接到由铝构成的陶瓷基板的表面并且包括Cu的金属板，其中接合界面处的Cu浓度在0.05〜5重量％的范围内 ％。

公开(公告)号：US20110074010A1

公开(公告)日：2011-03-31

申请号：US12737042

申请日：2009-06-05

申请人： Yoshirou Kuromitsu ,  Yoshiyuki Nagatomo ,  Takeshi Kitahara ,  Hiroshi Tonomura ,  Kazuhiro Akiyama

发明人： Yoshirou Kuromitsu ,  Yoshiyuki Nagatomo ,  Takeshi Kitahara ,  Hiroshi Tonomura ,  Kazuhiro Akiyama

IPC分类号： H01L23/373 ,  H01R43/00

CPC分类号： H01L21/76838 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  C04B2237/407 ,  H01L23/3735 ,  H01L23/498 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2924/01322 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  Y10T29/49117 ,  Y10T428/12056 ,  Y10T428/12486 ,  Y10T428/12576 ,  Y10T428/12611 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01029 ,  H01L2924/00

摘要： A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %.

摘要翻译： 功率模块基板包括：具有表面的陶瓷基板; 以及在陶瓷基板和金属板之间的接合界面处连接到由铝构成的陶瓷基板的表面并且包括Cu的金属板，其中接合界面处的Cu浓度在0.05〜5重量％的范围内 ％。

公开(公告)号：US20130010429A1

公开(公告)日：2013-01-10

申请号：US13394923

申请日：2010-09-07

申请人： Hiroshi Tonomura ,  Yoshiyuki Nagatomo ,  Yoshirou Kuromitsu

发明人： Hiroshi Tonomura ,  Yoshiyuki Nagatomo ,  Yoshirou Kuromitsu

IPC分类号： B23K31/02 ,  B23K1/19 ,  H05K7/20

CPC分类号： H01L23/3735 ,  C04B37/026 ,  C04B2237/124 ,  C04B2237/126 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/704 ,  H01L23/467 ,  H01L23/473 ,  H01L24/32 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/01049

摘要： A method for producing a substrate for a power module with a heat sink includes a heat sink bonding step for bonding a heat sink to the surface of a second metal plate. The heat sink bonding step includes: a Cu layer forming step for forming a Cu layer on at least one of the surface of the second metal plate and a bonding surface of the heat sink; a heat sink laminating step for laminating the second metal plate and the heat sink via the Cu layer; a heat sink heating step for pressing in the lamination direction and heating the second metal plate and the heat sink, to diffuse Cu in the Cu layer into the second metal plate and the heat sink; and a molten metal solidifying step for solidifying the molten metal formed with Cu diffusion, to bond the second metal plate and the heat sink.

摘要翻译： 一种用于制造具有散热器的功率模块用基板的方法，包括将散热器接合到第二金属板的表面的散热焊接工序。 散热焊接工序包括：Cu层形成步骤，用于在第二金属板的表面中的至少一个表面和散热片的接合表面上形成Cu层; 散热层叠步骤，用于经由所述Cu层层压所述第二金属板和所述散热片; 散热器加热步骤，用于在层叠方向上按压并加热第二金属板和散热片，以使Cu层中的Cu扩散到第二金属板和散热片中; 以及熔融金属固化步骤，用于固化由Cu扩散形成的熔融金属，以将第二金属板和散热片结合。

公开(公告)号：US20100258233A1

公开(公告)日：2010-10-14

申请号：US12734428

申请日：2008-11-06

申请人： Hiroshi Tonomura ,  Takeshi Kitahara ,  Hiroya Ishizuka ,  Yoshirou Kuromitsu ,  Yoshiyuki Nagatomo

发明人： Hiroshi Tonomura ,  Takeshi Kitahara ,  Hiroya Ishizuka ,  Yoshirou Kuromitsu ,  Yoshiyuki Nagatomo

IPC分类号： B32B37/04 ,  C04B35/14 ,  B29C35/08 ,  G01N33/38 ,  C04B35/64

CPC分类号： B23K1/20 ,  C04B35/584 ,  C04B37/026 ,  C04B2235/72 ,  C04B2235/721 ,  C04B2235/723 ,  C04B2235/96 ,  C04B2237/121 ,  C04B2237/128 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/52 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/86 ,  H01L21/4807 ,  H01L21/481 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/473 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/38 ,  H05K3/381 ,  H05K2201/0355 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/095 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed is a ceramic substrate including silicon in which the concentration of a silicon oxide and a silicon composite oxide in the surface thereof is less than or equal to 2.7 Atom %.

摘要翻译： 公开了包括硅的陶瓷基板，其表面中的氧化硅和硅复合氧化物的浓度小于或等于2.7原子％。

公开(公告)号：US09076755B2

公开(公告)日：2015-07-07

申请号：US13394923

申请日：2010-09-07

申请人： Hiroshi Tonomura ,  Yoshiyuki Nagatomo ,  Yoshirou Kuromitsu

发明人： Hiroshi Tonomura ,  Yoshiyuki Nagatomo ,  Yoshirou Kuromitsu

IPC分类号： H05K7/20 ,  H05K1/00 ,  H01L23/373 ,  H01L23/467 ,  H01L23/473

CPC分类号： H01L23/3735 ,  C04B37/026 ,  C04B2237/124 ,  C04B2237/126 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/704 ,  H01L23/467 ,  H01L23/473 ,  H01L24/32 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/01049

摘要： A method for producing a substrate for a power module with a heat sink includes a heat sink bonding step for bonding a heat sink to the surface of a second metal plate. The heat sink bonding step includes: a Cu layer forming step for forming a Cu layer on at least one of the surface of the second metal plate and a bonding surface of the heat sink; a heat sink laminating step for laminating the second metal plate and the heat sink via the Cu layer; a heat sink heating step for pressing in the lamination direction and heating the second metal plate and the heat sink, to diffuse Cu in the Cu layer into the second metal plate and the heat sink; and a molten metal solidifying step for solidifying the molten metal formed with Cu diffusion, to bond the second metal plate and the heat sink.

摘要翻译： 一种用于制造具有散热器的功率模块用基板的方法，包括将散热器接合到第二金属板的表面的散热焊接工序。 散热焊接工序包括：Cu层形成步骤，用于在第二金属板的表面中的至少一个表面和散热片的接合表面上形成Cu层; 散热层叠步骤，用于经由所述Cu层层压所述第二金属板和所述散热片; 散热器加热步骤，用于在层叠方向上按压并加热第二金属板和散热片，以使Cu层中的Cu扩散到第二金属板和散热片中; 以及熔融金属固化步骤，用于固化由Cu扩散形成的熔融金属，以将第二金属板和散热片结合。

公开(公告)号：US08609993B2

公开(公告)日：2013-12-17

申请号：US12736813

申请日：2009-05-15

申请人： Yoshirou Kuromitsu ,  Kazuhiro Akiyama ,  Takeshi Kitahara ,  Hiroshi Tonomura

发明人： Yoshirou Kuromitsu ,  Kazuhiro Akiyama ,  Takeshi Kitahara ,  Hiroshi Tonomura

IPC分类号： H05K1/03

CPC分类号： H05K1/053 ,  H01L23/3735 ,  H01L2224/32225 ,  H05K1/021 ,  H05K1/0212 ,  H05K1/18 ,  H05K1/181 ,  H05K7/06 ,  Y10T29/49124 ,  Y10T428/12576

摘要： A power module substrate includes: a ceramics substrate composed of AlN, having a top face; a metal plate composed of pure aluminum and joined to the top face of the ceramics substrate with a brazing filler metal including silicon interposed therebetween; and a high concentration section formed at a joint interface at which the metal plate is joined to the ceramics substrate, having a silicon concentration that is more than five times the silicon concentration in the metal plate.

摘要翻译： 功率模块基板包括：具有顶面的由AlN构成的陶瓷基板; 由纯铝构成的金属板，并且在陶瓷基板的顶面与包含硅的钎料相接合; 以及形成在金属板与陶瓷基板接合的接合界面处的高浓度部分，其硅浓度大于金属板中的硅浓度的五倍。

公开(公告)号：US20110067906A1

公开(公告)日：2011-03-24

申请号：US12736813

申请日：2009-05-15

申请人： Yoshirou Kuromitsu ,  Kazuhiro Akiyama ,  Takeshi Kitahara ,  Hiroshi Tonomura

发明人： Yoshirou Kuromitsu ,  Kazuhiro Akiyama ,  Takeshi Kitahara ,  Hiroshi Tonomura

IPC分类号： H05K1/03 ,  H05K3/00

CPC分类号： H05K1/053 ,  H01L23/3735 ,  H01L2224/32225 ,  H05K1/021 ,  H05K1/0212 ,  H05K1/18 ,  H05K1/181 ,  H05K7/06 ,  Y10T29/49124 ,  Y10T428/12576

摘要： A power module substrate includes: a ceramics substrate composed of AlN, having a top face; a metal plate composed of pure aluminum and joined to the top face of the ceramics substrate with a brazing filler metal including silicon interposed therebetween; and a high concentration section formed at a joint interface at which the metal plate is joined to the ceramics substrate, having a silicon concentration that is more than five times the silicon concentration in the metal plate.

摘要翻译： 功率模块基板包括：具有顶面的由AlN构成的陶瓷基板; 由纯铝构成的金属板，并且在陶瓷基板的顶面与包含硅的钎料相接合; 以及形成在金属板与陶瓷基板接合的接合界面处的高浓度部分，其硅浓度大于金属板中的硅浓度的五倍。

公开(公告)号：US20090145642A1

公开(公告)日：2009-06-11

申请号：US12303513

申请日：2007-06-06

申请人： Yoshirou Kuromitsu ,  Hiroya Ishizuka ,  Hiroshi Miyata ,  Takeshi Kitahara ,  Hiroshi Tonomura

发明人： Yoshirou Kuromitsu ,  Hiroya Ishizuka ,  Hiroshi Miyata ,  Takeshi Kitahara ,  Hiroshi Tonomura

IPC分类号： H05K1/03 ,  H05K3/10

CPC分类号： H01L23/3736 ,  H01L23/3735 ,  H01L23/473 ,  H01L24/32 ,  H01L2224/32225 ,  H05K1/09 ,  H05K3/38 ,  H05K2201/0269 ,  Y10T29/49124

摘要： A power element mounting substrate including a circuit layer brazed to a surface of a ceramic plate, and a power element soldered to a front surface of the circuit layer, wherein the circuit layer is constituted using an Al alloy with an average purity of more than or equal to 98.0 wt % and less than or equal to 99.9 wt %, Fe concentration of the circuit layer at a side of a surface to be brazed to the ceramic plate is less than 0.1 wt %, and Fe concentration of the circuit layer at a side of the surface opposite to the surface to be brazed is more than or equal to 0.1 wt %.

摘要翻译： 一种功率元件安装基板，包括钎焊到陶瓷板的表面的电路层和焊接到电路层的前表面的功率元件，其中电路层使用平均纯度大于或等于 等于98.0重量％且小于或等于99.9重量％时，要钎焊到陶瓷板的表面侧的电路层的Fe浓度小于0.1重量％，电路层的铁浓度在 与钎焊表面相对的表面的一侧大于或等于0.1重量％。