发明申请
US20140002188A1 POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND METHODS
有权
功率放大器模块,包括相关系统,器件和方法
- 专利标题: POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND METHODS
- 专利标题(中): 功率放大器模块,包括相关系统,器件和方法
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申请号: US13917384申请日: 2013-06-13
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公开(公告)号: US20140002188A1公开(公告)日: 2014-01-02
- 发明人: Howard E. Chen , Yifan Guo , Dinhphuoc Vu Hoang , Mehran Janani , Tin Myint Ko , Philip John Lehtola , Anthony James LoBianco , Hardik Bhupendra Modi , Hoang Mong Nguyen , Matthew Thomas Ozalas , Sandra Louise Petty-Weeks , Matthew Sean Read , Jens Albrecht Riege , David Steven Ripley , Hongxiao Shao , Hong Shen , Weimin Sun , Hsiang-Chih Sun , Patrick Lawrence Welch , Peter J. Zampardi, JR. , Guohao Zhang
- 申请人: SKYWORKS SOLUTIONS, INC.
- 申请人地址: US MA Woburn
- 专利权人: SKYWORKS SOLUTIONS, INC.
- 当前专利权人: SKYWORKS SOLUTIONS, INC.
- 当前专利权人地址: US MA Woburn
- 主分类号: H03F3/19
- IPC分类号: H03F3/19
摘要:
A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3×1016 cm−3 at a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.
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