Invention Application
- Patent Title: LIGAND GRAFT FUNCTIONALIZED SUBSTRATES
- Patent Title (中): LIGAND GRAFT功能基板
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Application No.: US14021190Application Date: 2013-09-09
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Publication No.: US20140004595A1Publication Date: 2014-01-02
- Inventor: Kannan Seshadri , Jerald K. Rasmussen , Clinton P. Waller, Jr. , Douglas E. Weiss , Yi He
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Main IPC: B01D39/16
- IPC: B01D39/16 ; C07K1/34
Abstract:
Polyethyleneimine and polyalkylene biguanide ligand functionalized substrates, methods of making ligand functionalized substrates, and methods of using functionalized substrates are disclosed.
Public/Granted literature
- US09302208B2 Ligand graft functionalized substrates Public/Granted day:2016-04-05
Information query
